Job Description
Shift 5:(Dayshiftcompressedworkweek) 6AM-6PM(Sunday-Tuesdayand alternatingWednesdays).
Shift 7:(Day shift compressed work week) 6AM-6PM (Thursday-Saturday and alternating Wednesdays).
Join Intel\'s Foundry Technology Manufacturing business unit and play a key role in shaping the future of semiconductor packaging. As aModule Engineer, you will develop andoptimizeassembly processes and equipment, applying innovative concepts to enable Intel\'s next-generation foundry packaging platform technologies. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions for our foundry customers.
- Design and develop assembly processes and equipment, applying novel engineering concepts to advance Intel\'s foundry packaging roadmap and platform technologies.
- Optimizemanufacturing efficiency for foundry packages, developing processes that meet rigorous quality, reliability, cost, yield, productivity, and manufacturability requirements specific to foundry customer needs.
- Define process and equipment specifications using Design of Experiments (DOE) and data analysis principles, documentinginnovationsand improvements through technical white papers.
- Develop andmaintainequipment used to evaluate silicon and package technologies under simulated field conditions, including thermal cycling, heat, humidity, and dynamic mechanical stress testing.
- Ensure physical package designs are manufacturable within foundry process flows, and oversee the full cycle of package manufacturing processes, procedures, and production flows.
- Establish material specifications for contract assemblers and raw material vendors, partnering closely with supplier quality and procurement teams to enforce process compliance and vendor performance standards.
- Create new reliability screening techniques, acceleration methods, and quality tools to enable early detection of potential packaging quality and reliability risks within the foundry manufacturing environment.
- Define reliability requirements aligned to foundry customer needs, and influence design decisions, materialselection, and process development based on a fundamental understanding of failure mechanisms.
- Lead continuous improvement initiatives using statistical methods and experimental design to innovate, troubleshoot, and enhance equipment and process performance.
- Serve as a technical resource for foundry packaging challenges, responding to customer and partnerrequestsand providing consultation on process improvements.
- Drive standardization across product qualification frameworks, manufacturing quality systems, and methodologies, while actively engaging with packaging technology development and partner engineering teams to assess process maturity and mitigate risks to key product milestones.
Qualifications
The Minimum qualifications arerequiredto be initially considered for this position.Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to theminimumrequirements and are considered a plus factor inidentifyingtop candidates.
- shiprequired.
- Bachelor\'s degree with 1+ years of experience?in one of the following fields: Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or ina STEMrelated field of study.
-OR-
- Master\'s degree?in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, orin a STEM related field of study.??
- Associate degree inMechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study with12+years?of experience inanengineering role.
- 6+ monthsofexperience with?Statistical Process Control (SPC)?and/or?Design of Experiments (DOE)?principles.
- Prior experience working in a?technology or semiconductor manufacturing environment.
- Experience insemiconductor packaging processes, including assembly, materials, or reliability engineering within a foundry context.
Why Intel Foundry Technology Manufacturing?
- Intel\'s Foundry Technology Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of customers. You will collaborate with world-class engineers, contribute tocutting-edgetechnology development, and directlyimpactthe quality and performance of products that power the global technology industry. This is your opportunity to grow your career while helping define the future of foundry manufacturing.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits
Annual Salary Range for jobs which could be performed in the US $94,300.00-$133,200.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.
* Job posting details (such as work model, location or time type) are subject to change.
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