Company:Qualcomm Technologies, Inc.
Job Area:Engineering Group, Engineering Group > Packaging Engineering
General Summary:This role represents an individual contributor within the CHS Signal Integrity organization responsible for end-to-end signal integrity and power integrity architecture, analysis, and signoff for next-generation mobile, compute, automotive, and various other connectivity platforms.
Core Responsibilities- Perform high-frequency measurements of passive structures using VNA and TDR
- Test, measure, and debug high-speed electrical signals and power delivery on active hardware
- Drive correlation between pre-silicon models and silicon/lab data
- Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions
- Drive adoption of best practices across programs
- Drive improvements in methods for system SI/PI
High-Speed Interface ExpertiseKnowledge of interfaces such as:
- Memory: LPDDR4/5/6
- High-speed IO: PCIe Gen4/5/6/7, USB4, UFS, 10G-112G+ PHYs
- Camera/Display: MIPI CSI/DSI
- System PDN
Required Education and Experience- Minimum of BS in electrical engineering or related discipline; MS preferred
- 4+ years' experience in Signal Integrity / Power Integrity / High-speed systems
Domain ExpertiseExpertise in Transmission line theory, EM fundamentals, SI/PI interactions, and jitter/noise coupling. Hands-on experience with: Tools such as HFSS, ADS, Sigrity, CST, SIwave, HSPICE; and measurement instruments such as VNA, TDR, real-time scopes
Minimum Qualifications: Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
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Pay range and Other Compensation & Benefits: $133,900.00 - $200,900.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
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