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Job Title: Senior Specialist, Electrical Engineer- Mixed-Signal DSP Hardware Engineer Job Code: 46257 Job Location: San Diego, CA
Job Schedule: 9/80 1st Shift Job Description:L3Harris is seeking a Senior Hardware Engineer to develop mixed-signal, high-speed digital, and DSP-oriented hardware for Tracking, Telemetry, and Command products used in airborne and space-based electronic systems. The role includes architecture, detailed design, verification, troubleshooting, integration, and production support for converter-based receiver, transmitter, direct-conversion, and modem subsystems incorporating high-speed ADCs, DACs, AFEs, PLLs, clock distribution, FPGA or ASIC interfaces, power supplies, and GHz-class signal interfaces. The ideal candidate will bring strong expertise in timing, synchronization, throughput, signal integrity, power integrity, noise performance, and hardware/software partitioning across modem and signal-processing systems.
Essential Functions:- Lead the design and development of mixed-signal, high-speed digital, and DSP hardware for advanced electronic systems, including receiver, transmitter, direct-conversion, and modem signal chains, with responsibility for architecture, schematic capture, component selection, derating, worst-case analysis, and hardware documentation.
- Design hardware that supports or implements DSP functions, including high-speed digital data paths, converter interfaces, synchronization, and throughput-critical processing chains, and optimize digital hardware platforms used to execute, accelerate, or interface with DSP algorithms.
- Guide PCB layout and board-level implementation for high-speed mixed-signal designs, including stack-up definition, placement, controlled impedance, grounding, isolation, power distribution, and design considerations for signal integrity, power integrity, dynamic range, jitter, phase noise, and overall noise performance.
- Conduct trade studies, simulations, hardware bring-up, debugging, design verification, and troubleshooting to the component level to support architecture selection, clocking strategy, hardware/software partitioning, and product performance through integration, test, manufacturing, and production.
- Collaborate closely with FPGA, ASIC, RF, DSP, software, systems, mechanical, and manufacturing engineering teams, and provide technical leadership and mentoring to junior engineers.
Qualifications- Bachelor's degree in Electrical Engineering or related field with 6+ years of prior related experience, or Graduate degree with 4+ years of prior related experience.
- Active Secret security clearance
Preferred Additional Skills- Experience designing mixed-signal and high-speed digital hardware using ADCs, DACs, AFEs, FPGA interfaces, ASIC interfaces, and high-speed digital data paths, including hardware that supports or implements DSP functions.
- Strong understanding of direct-conversion, modem, and related communications and signal-processing architectures, including timing, synchronization, clocking, throughput, and converter interfaces such as JESD204.
- Experience optimizing hardware platforms for DSP algorithms and working at the hardware/software boundary, including partitioning functions across hardware, programmable logic, embedded processing, and software-defined modem implementations.
- Experience with signal integrity, power integrity, low-noise power design, and GHz-class board-level implementation, including design and implementation of point-of-load power supplies for FPGAs, ADCs, DACs, AFEs, and other high-performance devices.
- Familiarity with RF principles as applied to converter-based and high-frequency modem systems.
- Experience with schematic capture, design analysis, laboratory debug, and design verification testing.
- Strong communication skills and ability to work effectively in a multidisciplinary engineering environment.
- Experience with direct RF sampling, integrated AFEs, modern converter-based system architectures, PLLs, synthesizers, jitter-cleaning clocks, clock buffering, and phase-coherent timing systems.
- Experience with SI/PI simulation, PCB layout guidance for high-speed mixed-signal hardware, and familiarity with performance metrics such as EVM, SNR, SFDR, ENOB, phase noise, I/Q imbalance, and LO leakage.
- Experience with RF and high-frequency modem architecture, DSP integration, partitioning of functions between hardware, FPGA or ASIC resources, firmware, and software, and modem implementation as part of a complete communications subsystem.
- Experience supporting high-reliability, military, or aerospace hardware development.
In compliance with pay transparency requirements, the salary range for this role in California is $106,500 - $197,500. This is not a guarantee of compensation or salary, as final offer amount may vary based on factors including but not limited to experience and geographic location. L3Harris also offers a variety of benefits, including health and disability insurance, 401(k) match, flexible spending accounts, EAP, education assistance, parental leave, paid time off, and company-paid holidays. The specific programs and options available to an employee may vary depending on date of hire, schedule type, and the applicability of collective bargaining agreements.
L3Harris Technologies is proud to be an Equal Opportunity Employer. L3Harris is committed to treating all employees and applicants for employment with respect and dignity and maintaining a workplace that is free from unlawful discrimination. All applicants will be considered for employment without regard to race, color, religion, age, national origin, ancestry, ethnicity, gender (including pregnancy, childbirth, breastfeeding or other related medical conditions), gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic information, citizenship status, characteristic or membership in any other group protected by federal, state or local laws. L3Harris maintains a drug-free workplace and performs pre-employment substance abuse testing and background checks, where permitted by law.
Please be aware many of our positions require the ability to obtain a security clearance. In addition, applicants who accept a conditional offer of employment may be subject to government security investigation(s) and must meet eligibility requirements for access to classified information.
By submitting your resume for this position, you understand and agree that L3Harris Technologies may share your resume, as well as any other related personal information or documentation you provide, with its subsidiaries and affiliated companies for the purpose of considering you for other available positions.
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