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AMD is powering the next generation of supercomputing, high-performance computing, cloud, and AI. Whether you're designing next-gen processors, enabling AI breakthroughs, or creating go-to-market plans, every role at AMD contributes to something bigger - technology that moves the world forward.
Job Role and Responsibility: AMD Design, LLC, a subsidiary of AMD, Inc., is hiring MTS Hardware Development Engineer to Support engineering team by loading, testing, and validating thermal solutions for rack mount servers. Recommend design changes and optimize configurations. Systematic use simulation early in the design process to prevent failure modes in products and assist in problem resolution. Troubleshoot thermal and airflow issues in new and existing product lines. Work with the engineering team to optimize thermal performance of servers using empirical data and bench test methods. Optimize airflow speed, volume, and flow paths to meet customer and components requirements. Support custom engineering projects that require hands-on ability to interconnect complex server systems. Use analytical tools to determine root cause and design changes required to remedy premature failures. Produce thermal reports from experimental data and test/modeling benchmarks. Create manufacturing feasible new product concepts by applying engineering principles and analytical techniques. Development of CFD and thermal simulation methods and the integration into existing/emerging engineering development processes. Utilize knowledge of mechanics, heat transfer, and computational fluid dynamics, as well as knowledge of design techniques, tools, and principles. Apply knowledge of engineering principles, best practices, and technologies to the design, development, and testing of various company proprietary products.
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Travel required: NO
Qualifications: Degree requiredMaster's degree or foreign equivalent in Mechanical Engineering, Computer Engineering, or related field.
Qualifications: Amount and type of experience required: Three (3) years of experience in job offered or in a closely related engineering role.
Alternate combination of education and experience: Employer will alternatively accept a Bachelor's degree or foreign equivalent in Mechanical Engineering, Computer Engineering, or related field and five (5) years of progressive post-baccalaureate experience in job offered or in a closely related engineering role.
Specific skills required: The following skills are required:Position requires three (3) years of experience in the following:
- Complete thermal design and validation cycle of HPC, AI, and storage servers;
- Conducting system-level thermal simulations to evaluate chassis airflow distribution to identify thermal bottlenecks and optimize component thermal performance;
- Defining and executing thermal test plans;
- Designing and developing custom heat sinks and cold plates;
- Selecting thermal interface materials (TIMs) to meet cooling demands of high-power CPUs and GPUs; and
- Validation of heat sink and fan designs.
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Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's "Responsible AI Policy" is available here.
This posting is for an existing vacancy.
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