Job DescriptionThe Role General Motors is at the forefront of the transformation of automotive with the electrification of our portfolio and the development of leading-edge central compute, connectivity, and autonomous capabilities. Our Semiconductor Engineering team is a dynamic, high-energy, and innovative group focused on design and commercialization of leading-edge silicon enabling the future of GM's Software Defined Vehicle (SDV) platforms-central compute units, connectivity modules, and other controllers.
We are seeking a highly skilled and driven Senior SoC Hardware Engineer to join our Semiconductor Center of Excellence. This pivotal role will lead the evaluation and integration of state of the art System-on-Chip (SoC) solutions into next generation automotive electronics platforms. You will collaborate with internal teams and silicon vendors to analyze SoC capabilities, influence selection decisions, and ensure seamless bring-up from schematic design through early testing and production.
Responsibilities- Conduct in depth technical evaluations and trade off studies on SoCs and other semiconductors to identify the optimal components for a range of automotive applications.
- Design and manage application schematics centered around SoCs for ECU development, ensuring high performance, cost effective solutions that meet system requirements.
- Collaborate cross functionally with hardware engineering, software development, and suppliers to define design specifications and align on architectural and system-level requirements.
- Develop clear and robust component specifications within your scope of responsibility to enable timely sourcing decisions aligned with electronic development and vehicle program milestones.
- Establish and execute test plans to evaluate SoCs and other silicon devices, including board bring up and early validation to ensure design intent is met ahead of formal qualification.
- Stay current with industry trends, maintaining a strong understanding of semiconductor product portfolios, supply chain dynamics, and emerging technology roadmaps.
- Provide technical mentorship and guidance to semiconductor engineering teams throughout the design cycle from architecture definition and component selection to design reviews and sourcing activities.
Qualifications - Required- Bachelor's degree in electrical engineering, computer engineering, or a related field
- 7+ years of experience in hardware design and development, with a significant system-level ownership
- Knowledge of SoC subsystems and IP blocks, including memory, analog, processor cores, interconnects, and peripherals.
- Demonstrated proficiency in SoC analysis and selection, including requirements driven studies, benchmarking, and technical trade-off evaluations.
- Hands-on experience with circuit design and analysis, including worst case analysis, DFMEA, circuit simulation tools and schematic capture tools (i.e. mentor graphics).
- Proven experience in silicon bring up and ECU level hardware integration and validation.
- Hands-on experience with hardware debugging tools such as oscilloscopes
- Exceptional collaboration and teamwork skills; proven ability to work across functional and organizational boundaries.
- Demonstrated ability to manage multiple projects simultaneously, including planning, execution, and monitoring.
- Strong problem-solving skills and ability to learn quickly.
Qualifications - Preferred- Master's degree or PhD in electrical engineering, computer engineering, or a related field.
- Extensive experience with Wireless Connectivity SoCs, including integration and optimization within complex automotive systems.
- Familiarity with Wi-Fi, Bluetooth, Cellular and related wireless technologies
- Industry background in SoC architecture definition, ideally through direct experience at a semiconductor company contributing to IP integration, architecture trade-offs, or platform development.
- Proven track record of leading ECU product development from initial requirements definition through to production launch, with a strong understanding of the end to end lifecycle.
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This role is categorized as hybrid. This means the selected candidate is expected to report to a specific location at least 3 times a week {or other frequency dictated by their manager}.The selected candidate will be required to travel <25% for this role.This job may be eligible for relocation benefits.
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