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7 results (7 new)

NXP Semiconductors N.V.
DCP Equipment Engineering Intern - Summer 2027

NXP Semiconductors N.V.

Austin, Texas • Today

Full-time

NXP Semiconductors N.V.
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NXP Semiconductors N.V.

Austin, Texas • Today

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NXP Semiconductors N.V.
Etch Equipment Engineer Intern - Summer 2027

NXP Semiconductors N.V.

Austin, Texas • Today

Full-time

NXP Semiconductors N.V.
CMP-Implant Engineer Intern - Summer 2027

NXP Semiconductors N.V.

Austin, Texas • Today

Full-time

NXP Semiconductors N.V.
Device/Yield Engineer Intern - Summer 2027

NXP Semiconductors N.V.

Austin, Texas • Today

Full-time

NXP Semiconductors N.V.
FAB Device Engineer Intern - Summer 2027

NXP Semiconductors N.V.

Austin, Texas • Today

Full-time

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NXP Semiconductors N.V.

DCP Equipment Engineering Intern - Summer 2027

NXP Semiconductors N.V.
Austin, TX, US • Posted 8 hours ago • Updated 8 hours ago
Full Time
On-site

Job Details

Skills

  • Semiconductor Fabrication
  • Management
  • Preventive Maintenance
  • Repair
  • Process Engineering
  • Manufacturing
  • Operating Systems
  • Testing
  • Mechanical Engineering
  • Materials Science
  • Electrical Engineering
  • Semiconductors
  • Communication
  • Conflict Resolution
  • Problem Solving
  • Mentorship
  • Semiconductor Fabrication
  • Management
  • Preventive Maintenance
  • Repair
  • Process Engineering
  • Manufacturing
  • Operating Systems
  • Testing
  • Mechanical Engineering
  • Materials Science
  • Electrical Engineering
  • Semiconductors
  • Communication
  • Conflict Resolution
  • Problem Solving
  • Mentorship

Summary

Job Summary:
  • Summer Engineering internship at NXP's ATMC wafer manufacturing facility
  • Approximately 12 weeks long
  • Learn the basics of semiconductor manufacturing, technology and operations
  • Work with an experienced engineer mentor to troubleshoot production equipment and process issues within the factory
  • Drive one or more real projects urgently needed by the fab related to key business metrics (Safety, Quality, Delivery, Cost)
  • Deliver real results to the business and present to factory senior management at the end of the internship
  • Equipment engineering will optimize the multi-million dollar production equipment (parts, preventative maintenance, cleaning and repair, etc.)
  • Process engineering will optimize the processes (materials, time, temperature, dose, etc.) of the various manufacturing steps

Key Challenges:
  • Integrating tool improvements across multiple tool types with different operating systems
  • Coordinating multiple activities with shared / limited resources

Cross functional aspects:
  • Work with cross functional teams (Process Engineers, Equipment Engineers, Operations, Facilities, etc) to accomplish testing, improving tool performance, tool installs, tool removals, tool moves.

Job Qualifications:
  • Must be currently working towards a BS in Engineering (Mechanical, Materials Science, Chemical or Electrical Engineering preferred)
  • A desire to learn about the semiconductor industry.
  • Strong verbal and written communication skills.
  • Good problem-solving skills.
  • Self-motivated; able to take initiative and work with a mentor.
  • Excellent interpersonal skills.

In order to be considered for a summer internship with NXP you must be returning to school or graduating at the conclusion of the internship term. If you are graduating prior to July 2027 please apply to Entry Level full-time roles.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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  • Dice Id: 80183766
  • Position Id: 235418db101b69fda8c6fa44c38ebc9
  • Posted 8 hours ago
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