ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world's most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.
Whether you're designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we'll advance your career.
THE ROLE- Lead a team of elite signal integrity engineers to develop a Product Design Guide for the industry's top GenAI accelerator
- Drive innovation in high-speed signaling, rack-level interconnects, and PCB architecture to support next-gen AI hardware
- Collaborate across packaging, SERDES, power, and board engineering teams to deliver breakthrough system designs
- Operate at the forefront of AI infrastructure, pushing technical boundaries under aggressive timelines
THE PERSON- Visionary and technically strong leader with deep expertise in signal integrity, PCB design, and high-speed interconnects
- Comfortable navigating complex cross-functional environments and driving alignment across silicon, system, and platform teams
- Thrives under pressure and excels in delivering high-impact results on compressed schedules
- Passionate about exploring copper and optical signaling technologies and scaling GenAI networking
KEY RESPONSIBILITIES- Lead development of the GenAI Product Design Guide with a focus on signal integrity and system-level performance
- Collaborate with SERDES and packaging teams to ensure silicon meets GenAI leadership goals
- Drive model creation and simulation for ultra-high-speed signaling technologies
- Push the limits of copper interconnects and explore optical signaling for rack-level networking
- Partner with the Power Design team to deliver the highest power-capable PCB without compromising other domains
- Work with the PCB technology team to achieve industry-leading layer counts and quality
- Coordinate with Board Engineering and Layout teams to support the largest silicon package ever conceived
- Ensure success of unprecedented copper bandwidth Ethernet switching within the rack
PREFERRED QUALIFICATIONS- Adept at modeling various channel components for high speed signaling.
- Comfortable using serial link simulation tools, including PAM4 simulations tools.
- Experience directing PCB layout of high speed serial links.
- Knowledge of cable and connector construction for cutting edge high speed data transmission.
ACADEMIC CREDENTIALS- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field
This role is not eligible for visa sponsorship.#LI-SC3
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's "Responsible AI Policy" is available here.
This posting is for an existing vacancy.
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