Lead thermal architecture for advanced avionics, ensuring electronics meet performance and reliability targets across worst-case mission environments (hot ramp, cold soak, high altitude).Deliver flight-worthy, integratable thermal designs (conduction, convection, liquid/air cooling) that reduce risk, rework, and schedule impacts during integration and test.Own end-to-end analysis and validation (CFD/FEA, derating, margins, qualification) to prove compliance with customer/airworthiness requiremen