Position: Hardware Design Engineering — Advanced Packaging
Location: Sunnyvale CA
Onsite
Key Responsibilities
● Perform SI/PI analysis and design optimization for advanced silicon packages (CoWoS, EMIB, chiplet-based architectures, fan-out wafer-level packaging)
● Develop and validate high-speed channel models for package interconnects including bumps, microbumps, TSVs, RDL layers, and silicon/organic interposers
● Conduct full-wave electromagnetic (EM) simulations of package structures to characterize S-parameters, crosstalk, impedance, and insertion/return loss
● Design and optimize Power Distribution Networks (PDN) — including decoupling strategy, IR drop analysis, and AC impedance profiling from die to board
● Perform time-domain simulations (eye diagram, BER analysis) for high-speed serial and parallel interfaces (PCIe Gen5/6, UCIe, HBM3/3E, DDR5, SerDes >112 Gbps)
● Collaborate with IC design, package substrate design, PCB layout, and thermal/mechanical teams to co-optimize package electrical performance
● Develop and correlate simulation models with lab measurements (VNA, TDR, oscilloscope, power noise measurements)
● Define SI/PI design guidelines and constraints for package substrate stackup, routing rules, and bump/via assignments
● Support design-for-manufacturability (DFM) reviews with OSAT partners and substrate vendors
● Investigate and resolve SI/PI-related failures during silicon bring-up and validation phases
Required Qualifications
● 5+ years of experience in SI/PI analysis for semiconductor packaging or high-speed PCB design
● Strong proficiency with industry-standard EM and circuit simulation tools:
1. EM Solvers: Ansys HFSS, Ansys SIwave, Cadence Clarity 3D, Keysight ADS Momentum
2. Circuit Simulation: Synopsys HSPICE, Cadence Spectre, Keysight ADS
3. PDN Analysis: Ansys RedHawk, Cadence Voltus, Sigrity PowerDC/PowerSI
● Deep understanding of transmission line theory, Maxwell''s equations, and S-parameter analysis
● Experience with high-speed interface protocols (PCIe, UCIe, HBM, DDR, Ethernet SerDes)
● Proficiency in package stackup design, impedance control, and via transition optimization
● Hands-on experience with measurement correlation (VNA, TDR/TDT, near-field scanning)
● Programming/scripting skills (Python, MATLAB, Tcl) for automation and post-processing
Preferred Qualifications
● Experience with 2.5D/3D advanced packaging technologies (CoWoS, EMIB, Foveros, hybrid bonding)
● Familiarity with chiplet-based disaggregated architectures and die-to-die interconnect standards (UCIe, BoW)
● Knowledge of co-simulation methodologies (chip-package-board co-design)
● Experience with statistical analysis and Monte Carlo methods for manufacturing variation impact
● Understanding of thermal-aware electrical analysis (electro-thermal co-simulation)
● Contributions to IEEE/DesignCon publications or industry standards committees (JEDEC, OIF, UCIe Consortium)
● Experience working with OSATs (ASE, Amkor, TSMC InFO/CoWoS) and substrate vendors
Alchemy: Transforming Your Professional Vision into Reality
Since our inception in 2013, Alchemy has been dedicated to reshaping organizational performance through innovative IT services. With a vision to empower businesses seeking a transformative edge, we’ve positioned ourselves at the forefront of digitization and software modernization.
Our name reflects our mission: to transmute technology into gold-standard solutions for our esteemed clients. We proudly serve a diverse range of sectors, including IT and ITES, BFSI, Telecom and Media, Automotive, Manufacturing, Energy, Oil and Gas, Real Estate, Retail, Healthcare, and more.
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