Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a Senior Engineer on Micron's Technology-AMAIS team, you will deliver high-impact, model-driven solutions for technology development. You will lead the delivery of composite models for DRAM modules, partner with technology and product teams, and provide predictive modeling insights to DRAM Process, PI, and PE organizations.
Responsibilities include:
- Develop composite models grounded in structural and stress physics to enable module co-optimization across wafer- and die-level metrics.
- Extract insights from predictive models, images, and data, and clearly communicate findings to engineering teams and leaders.
- Collaborate across functions to integrate ML and agentic solutions into composite models that meet engineering needs.
- Use computational and AI techniques to train robust models on sparse datasets.
- Build structural models that integrate process flow, layout, materials, and thermo-mechanical response.
- Apply multiscale stress modeling to assess stress, strain, deformation, cracking, voiding, and layout-related risk.
- Partner with layout, PI, and integration teams to guide design and integration decisions.
- Support root-cause analysis and predictive risk assessment using physics-based models augmented with data.
- Drive model-informed process integration strategies to improve yield.
Minimum Qualifications:
- Bachelor's degree with 5+ years' experience, or MS with 3+ years, or PhD (or equivalent experience) in Engineering, Artificial Intelligence, Data Science, Applied Mathematics/Sciences, or a related field.
- Advanced multiscale structural modeling expertise.
- Strong foundation in numerical methods, high-performance computing (HPC), and ML/AI algorithms.
- Experience with innovative multiphysics and multiscale methods and ML/DL/AI libraries for high-dimensional, dynamic datasets.
- Proficient in Linux, C++, and Python; experience in cloud or HPC environments.
- Excellent verbal and written communication skills.
Preferred Qualifications: - Proven experience in multiphysics and multiscale structural modeling.
- Exposure to layout-aware stress analysis or process-structure interactions.
- Experience in the memory industry is a strong plus.
- Prior experience as a Process or PI engineer.
- Experience creating enterprise-level documentation and presenting to senior leaders.
- Knowledge of the semiconductor industry.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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