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Circuit Design Engineer

ComTec Information Systems

Cincinnati, Ohio • Yesterday

Easy Apply

Contract

70 - 80

Engineer Circuit Design 3

Judge Group, Inc.

Cincinnati, Ohio • Today

Contract

USD 70.00 - 85.00 per hour

Engineer Circuit Design 3

Apex Systems

Cincinnati, Ohio • Today

Easy Apply

Full-time

$60 - $80 per hour

Specialist, Mechanical Design Engineer

Harris Corporation

Cincinnati, Ohio • Today

Full-time

USD 40,000.00 per year

Lead Engineer- Advanced Programs Mechanical Design

GE Aerospace

Evendale, Ohio • Today

Full-time

Composites Lead Mechanical Design Engineer

GE Aerospace

Evendale, Ohio • Today

Full-time

Engineer II, Mechanical Systems Design

Schneider Electric

Fairfield, Ohio • Today

Full-time

USD 86,400.00 - 129,600.00 per year

Senior Engineer I, Mechanical Systems Design

Schneider Electric

Fairfield, Ohio • Today

Full-time

USD 101,600.00 - 152,400.00 per year

Mechanical Design Engineer Specializing in HVAC

Curtiss-Wright

Cincinnati, Ohio • Today

Full-time

USD 82,000.00 - 110,000.00 per year

Senior Mechanical Design Engineer

Quest Defense Systems & Solutions, Inc.

Cincinnati, Ohio • Today

Full-time

USD 77,000.00 - 92,500.00 per year

Advanced Lead Engineer - Product Definition (Nozzle-Blade Design)

GE Aerospace

Ohio • Today

Full-time

Mechanical Design Engineer

Quest Defense Systems & Solutions, Inc.

Cincinnati, Ohio • Today

Full-time

USD 67,000.00 - 77,500.00 per year

Mechanical Design Engineer - Next Generation Products

GE Aerospace

Evendale, Ohio • Today

Full-time

Substation Senior Engineer - Physical Design

Electrical Consultants, Inc.

Fairfield, Ohio • Today

Full-time

Design Verification (DV) engineer

eTeam, Inc.

Remote • 2d ago

Easy Apply

Contract

65 - 70

Project Design Engineer - Physical Security & Fire/Life Saftey

Brookfield Global

Remote or Hybrid in Dallas, Texas • Today

Easy Apply

Full-time

Depends on Experience

Design Engineer

Motion Recruitment Partners, LLC

Remote • Today

Easy Apply

Full-time

USD 150,000.00 - 300,000.00 per year

DSP Software Design Engineer

Motion Recruitment Partners, LLC

Remote or Rochester, New York • Today

Easy Apply

Contract

Project Mechanical Engineer - Federal Engineering and Design

Olsson

Remote or Kansas • Today

Full-time

AI Infrastructure DC Design Engineer II

Astreya Partners

Remote or Tennessee • Today

Full-time

USD 85,120.00 - 134,400.00 per year

Design Engineer

Motion Recruitment Partners, LLC

Remote or Wichita, Kansas • Today

Easy Apply

Contract

Mechanical System Design & Analysis Engineer 3

Boeing Company

Remote or Cambridge, Massachusetts • 30+d ago

Full-time

USD 96,050.00 - 150,650.00 per year

ASIC DESIGN LEAD / SENIOR CHIP DESIGN ENGINEER

Galaxy Infotech INC

Remote • Today

Easy Apply

Contract

100+

Senior Design Engineer- Physical Security

Dale Workforce Solutions

Remote • Today

Easy Apply

Contract

Depends on Experience

Design Engineer - Physical Security Systems

Brookfield Global

Remote • Today

Easy Apply

Full-time

Depends on Experience

Altium PCB Layout Design Engineer

Ace Technologies, Inc.

Remote • 3d ago

Easy Apply

Contract

Depends on Experience

Senior Software Engineer, Design Systems

Thumbtack

Remote • Today

Full-time

USD 210,800.00 - 272,800.00 per year

Lead Engineer - Overhead Transmission Line Design

Qualis LLC

Remote or Palm Beach Gardens, Florida • Today

Full-time

USD 130,000.00 - 190,000.00 per year

Design Verification Engineer

Nexorant LLC

Remote • Yesterday

Easy Apply

Full-time

75000 - 100,000

Senior Electrical Engineer - Building Design

Olsson

Remote or Arizona • Today

Full-time

Job Details

Skills

Summary

Must Have

5 Years with Bachelors in Science; 3 Years with Masters; 1 Year with PhD
Excellent organizational and problem solving skills with a demonstrated ability to adapt effectively to changing requirements
Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity
Experience generating artwork and PCB/CCA documentation for procurement and assembly houses
Experience with the layout of PCBs and circuit card assemblies, including placement and routing of high speed digital, RF, and/or mixed signal circuits
Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high reliability criteria
Minimum 5 years of experience performing engineering/layout of printed circuit boards using PADS
Willingness and ability to work on site full time at the Cincinnati, OH location
Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations

We are seeking a Principal PCB Layout Designer using PADS based out of Cincinnati, OH. As a Principal PCB Layout Design Engineer at Northrop Grumman, you will have a challenging and rewarding opportunity to support the design and delivery of highreliability circuit card assemblies for aerospace, defense, and space flight applications. You will collaborate across electrical, mechanical, manufacturing, and signal integrity disciplines to transform complex electrical architectures and schematics into robust, productionready printed circuit board solutions. The successful candidate will be collaborative, open, and teamoriented, with a focus on shared responsibility, continuous learning, and a culture of innovation and technical excellence.

For this role, responsibilities include but are not limited to:

Execute the placement and routing of complex, highdensity, multilayer printed circuit boards (PCBs), including highspeed digital, RF, mixedsignal, and power circuits
Interpret electrical schematics, constraints, and mechanical boundaries to develop optimized PCB layouts that meet performance, reliability, and manufacturability requirements
Generate and maintain complete PCB and circuit card assembly (CCA) fabrication and assembly documentation packages, including artwork, drawings, fabrication notes, and data outputs for procurement and assembly partners
Apply current IPC and highreliability industry standards, as well as applicable military and aerospace criteria, in the design and verification of printed wiring boards and circuit card assemblies
Collaborate closely with electrical, mechanical, manufacturing, and signal integrity engineers to address layoutrelated design challenges involving signal integrity, power integrity, thermal management, and packaging
Support and perform Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews using automated and manual checks to improve yield, test coverage, and product robustness
Work with fabrication and assembly suppliers to understand manufacturing capabilities and constraints and incorporate them into PCB designs
Support PCB library management practices, ensuring correct use of symbols, footprints, and parameter data in accordance with internal workflows
Independently own PCB layout tasks from concept through fabrication data release in support of program cost, schedule, and technical requirements
Lead advanced PCB layout efforts using technologies such as HighDensity Interconnect (HDI), microvias, viainpad, backdrilling, and specialized substrate materials; provide technical guidance, peer reviews, and mentoring to other layout designers

Basic Qualifications:

5 Years with Bachelors in Science; 3 Years with Masters; 1 Year with PhD
Willingness and ability to work onsite fulltime at the Cincinnati, OH location
Minimum 5 years of experience performing engineering/layout of printed circuit boards using PADS
Experience with the layout of PCBs and circuit card assemblies, including placement and routing of highspeed digital, RF, and/or mixedsignal circuits
Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity
Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations
Familiarity with IPC industry standards for PCB design and fabrication and current understanding of highreliability criteria
Experience generating artwork and PCB/CCA documentation for procurement and assembly houses
Excellent organizational and problemsolving skills with a demonstrated ability to adapt effectively to changing requirements

Preferred Qualifications

Prior experience on defense or space flight programs with stringent reliability, documentation, and traceability requirements
Demonstrated experience in the layout of advanced, highdensity, multilayer printed circuit boards combining RF, highspeed digital, and highpower circuit sections
Knowledge of PCB process workflows and library management, including creation and governance of symbols, footprints, and reusable layout elements
Ability to translate complex mechanical boundaries and electrical constraints into optimized physical PCB layouts across multiple boards or modules
Knowledge of highreliability military and aerospace hardware criteria (e.g., MILPRF31032, MILSTD883, IPC Class 3/3A), or comparable experience demonstrating equivalent rigor

Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.

Dice Id: 10121335
Position Id: 9120579
Posted 1 day ago

Fitment

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Naveen Kumar

Account Manager @ ComTec Information Systems

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5 Years with Bachelors in Science; 3 Years with Masters; 1 Year with PhD
Excellent organizational and problem solving skills with a demonstrated ability to adapt effectively to changing requirements
Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity
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Experience with the layout of PCBs and circuit card assemblies, including placement and routing of high speed digital, RF, and/or mixed signal circuits
Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high reliability criteria
Minimum 5 years of experience performing engineering/layout of printed circuit boards using PADS
Willingness and ability to work on site full time at the Cincinnati, OH location
Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations

For this role, responsibilities include but are not limited to:

Execute the placement and routing of complex, highdensity, multilayer printed circuit boards (PCBs), including highspeed digital, RF, mixedsignal, and power circuits
Interpret electrical schematics, constraints, and mechanical boundaries to develop optimized PCB layouts that meet performance, reliability, and manufacturability requirements
Generate and maintain complete PCB and circuit card assembly (CCA) fabrication and assembly documentation packages, including artwork, drawings, fabrication notes, and data outputs for procurement and assembly partners
Apply current IPC and highreliability industry standards, as well as applicable military and aerospace criteria, in the design and verification of printed wiring boards and circuit card assemblies
Collaborate closely with electrical, mechanical, manufacturing, and signal integrity engineers to address layoutrelated design challenges involving signal integrity, power integrity, thermal management, and packaging
Support and perform Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews using automated and manual checks to improve yield, test coverage, and product robustness
Work with fabrication and assembly suppliers to understand manufacturing capabilities and constraints and incorporate them into PCB designs
Support PCB library management practices, ensuring correct use of symbols, footprints, and parameter data in accordance with internal workflows
Independently own PCB layout tasks from concept through fabrication data release in support of program cost, schedule, and technical requirements
Lead advanced PCB layout efforts using technologies such as HighDensity Interconnect (HDI), microvias, viainpad, backdrilling, and specialized substrate materials; provide technical guidance, peer reviews, and mentoring to other layout designers

Basic Qualifications:

5 Years with Bachelors in Science; 3 Years with Masters; 1 Year with PhD
Willingness and ability to work onsite fulltime at the Cincinnati, OH location
Minimum 5 years of experience performing engineering/layout of printed circuit boards using PADS
Experience with the layout of PCBs and circuit card assemblies, including placement and routing of highspeed digital, RF, and/or mixedsignal circuits
Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity
Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations
Familiarity with IPC industry standards for PCB design and fabrication and current understanding of highreliability criteria
Experience generating artwork and PCB/CCA documentation for procurement and assembly houses
Excellent organizational and problemsolving skills with a demonstrated ability to adapt effectively to changing requirements

Preferred Qualifications

Prior experience on defense or space flight programs with stringent reliability, documentation, and traceability requirements
Demonstrated experience in the layout of advanced, highdensity, multilayer printed circuit boards combining RF, highspeed digital, and highpower circuit sections
Knowledge of PCB process workflows and library management, including creation and governance of symbols, footprints, and reusable layout elements
Ability to translate complex mechanical boundaries and electrical constraints into optimized physical PCB layouts across multiple boards or modules
Knowledge of highreliability military and aerospace hardware criteria (e.g., MILPRF31032, MILSTD883, IPC Class 3/3A), or comparable experience demonstrating equivalent rigor

Dice Id: 10121335
Position Id: 9120579
Posted 1 day ago

Fitment