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Job Title: Firmware Engineer Exp: 6-10 years Location: Dallas, TX (Onsite) Key skills - OCP DC-SCM/DC-MHS, USB OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components. Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP. Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness. OCP Collaboration: Represent the program in OCP working-
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Full-time, Part-time, Contract, Third Party