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Principal Application Engineer - semiconductor packaging

Intermedia Group

Irvine, California • Today

Full-time

USD 130,000.00 - 155,000.00 per year

Principal Embedded Software Engineer

Motorola Solutions

Irvine, California • Today

Full-time

USD 180,000.00 - 220,000.00 per year

Principal Engineer

ServiceTitan

Remote or Glendale, California • Today

Full-time

Compensation information provided in the description

Principal Application Engineer

Henkel Inc.

Irvine, California • Today

Full-time

USD 140,000.00 - 165,000.00 per year

Principal Engineer

York Solutions, LLC

Remote or Hybrid • Today

Easy Apply

Contract

$80-$100 an hour

Protection Principal Engineer

Electric Power Engineers

Remote or Austin, Texas • Today

Full-time

Principal Engineer - Packaging Equipment

Conagra Brands

Remote or Omaha, Nebraska • Today

Full-time

USD 109,000.00 - 159,000.00 per year

Principal Engineer, Electronics

Safran

Carson, California • Today

Full-time

USD 141,730.00 - 222,720.00 per year

Principal Engineer, Product Engineering

1Password

Remote or Canada, Kentucky • Today

Full-time

USD 246,000.00 per year

Principal Engineer

City of Durham, Technology Solutions Dept.

Remote or Durham, North Carolina • Today

Full-time

USD 87,367.00 - 135,428.00 per year

Job Details

Skills

Manufacturing
KPI
Innovation
Continuous Improvement
Testing
Sales
Marketing
Pure Data
Software Engineering
Materials Science
Chemical Engineering
Mechanical Engineering
Semiconductors
2.5D
3D Computer Graphics
Communication
Management
FOCUS
Recruiting
LinkedIn

Summary

OPEN JOB: Principal Application Engineer - semiconductor packaging
LOCATION: Irvine, California
***Relocation Assistance Available
INDUSTRY: Manufacturing & Production
BASE SALARY: $130,000 to $155,000

This position is with our client's Adhesive Technologies business unit (adhesives, sealants and functional coatings)

What you'll do

Develop and evaluate KPI results and drive innovation and continuous improvement via data driven decisions and actions
Leverage semiconductor knowledge in advanced packaging e.g. 2.5D, HBM, CoWoS technical requirement and trend to accelerate material testing and test vehicle development
Primary technical interface to leading edge clients, addressing and resolving issues related to product implementation, functionality, or performance
Responsible for application functions and tasks to sales, marketing, PD and other business units
Manage a small (2-4) Application Engineering team to achieve project deliverables

Requirements:

Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field
12 years of experience in semiconductor packaging or processes with people manager experience
Solid understanding of current and emerging packaging trends, including 2.5D and 3D packaging
Proven ability to work independently and lead technical discussions with customers
Strong communication skills with a customer-focused, ownership-driven mindset
Effective project and time management skills, with a consistent focus on quality and delivery
Willingness to travel up to 10%
Ability to take meetings with our APAC team during off-hours

If you are interested in pursuing this opportunity, please respond back and include the following:

MS WORD Resume
required compensation.
Contact information.
Availability

Upon receipt, one of our managers will contact you to discuss the position in full detail.

STEPHEN FLEISCHNER
Recruiting Manager
INTERMEDIA GROUP, INC.
EMAIL:
LINKEDIN:

Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.

Dice Id: 10113648
Position Id: 955e4399b9b5b2126326e95ee2f12eff
Posted 30+ days ago

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At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Solutions Architect Engineer (AE) Advanced Packaging, 3D-IC and SI/PI Location United States (Remote or Hybrid) Job Summary Cadence is seeking a highly motivated and experienced Solutions Application Engineer to support customers developing next-generation advanced packaging solutions, including 2.5D, 3D-IC, chiplet-based architectures, AI/HPC packages, and heterogeneous integratio

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