Senior PCB layout design engineer// Remote 100%

For this role, responsibilities include but are not limited to:

• Execute the placement and routing of complex, high‑density, multi‑layer printed circuit boards (PCBs), including high‑speed digital, RF, mixed‑signal, and power circuits
• Interpret electrical schematics, constraints, and mechanical boundaries to develop optimized PCB layouts that meet performance, reliability, and manufacturability requirements
• Generate and maintain complete PCB and circuit card assembly (CCA) fabrication and assembly documentation packages, including artwork, drawings, fabrication notes, and data outputs for procurement and assembly partners
• Apply current IPC and high‑reliability industry standards, as well as applicable military and aerospace criteria, in the design and verification of printed wiring boards and circuit card assemblies
• Collaborate closely with electrical, mechanical, manufacturing, and signal integrity engineers to address layout‑related design challenges involving signal integrity, power integrity, thermal management, and packaging
• Support and perform Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews using automated and manual checks to improve yield, test coverage, and product robustness
• Work with fabrication and assembly suppliers to understand manufacturing capabilities and constraints and incorporate them into PCB designs
• Support PCB library management practices, ensuring correct use of symbols, footprints, and parameter data in accordance with internal workflows
• Independently own PCB layout tasks from concept through fabrication data release in support of program cost, schedule, and technical requirements
• Lead advanced PCB layout efforts using technologies such as High‑Density Interconnect (HDI), microvias, via‑in‑pad, backdrilling, and specialized substrate materials; provide technical guidance, peer reviews, and mentoring to other layout designers

Basic Qualifications:

• 5 Years with Bachelors in Science; 3 Years with Masters; 1 Year with PhD.  An additional 4 years of relevant experience could be considered in lieu of a degree.
• Willingness and ability to work on‑site full‑time at the Cincinnati, OH location
• Minimum 5 years of experience performing engineering/layout of printed circuit boards using PADS
• Experience with the layout of PCBs and circuit card assemblies, including placement and routing of high‑speed digital, RF, and/or mixed‑signal circuits
• Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity
• Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations
• Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high‑reliability criteria
• Experience generating artwork and PCB/CCA documentation for procurement and assembly houses
• Excellent organizational and problem‑solving skills with a demonstrated ability to adapt effectively to changing requirements

Preferred Qualifications

• Prior experience on defense or space flight programs with stringent reliability, documentation, and traceability requirements
• Demonstrated experience in the layout of advanced, high‑density, multi‑layer printed circuit boards combining RF, high‑speed digital, and high‑power circuit sections
• Knowledge of PCB process workflows and library management, including creation and governance of symbols, footprints, and reusable layout elements
• Ability to translate complex mechanical boundaries and electrical constraints into optimized physical PCB layouts across multiple boards or modules
• Knowledge of high‑reliability military and aerospace hardware criteria (e.g., MIL‑PRF‑31032, MIL‑STD‑883, IPC Class 3/3A), or comparable experience demonstrating equivalent rigor