PCB Layout Engineer

We are looking for an experienced PCB Layout Engineer with a strong, recent hands-on background in complex high-speed and high-density PCB design. The ideal candidate should be comfortable working independently and contributing to advanced optical communication products.

Key Responsibilities

• Design and develop complex PCB and package substrate layouts for advanced communication products.
• Work on high-speed, high-density multilayer PCB designs.
• Ensure PCB layouts comply with IPC standards, internal design practices, and fabrication requirements.
• Collaborate closely with Electrical, Mechanical, Thermal, Signal Integrity, Power Integrity, and Manufacturing teams.
• Work directly with PCB fabricators and substrate vendors to resolve DFM and manufacturing issues.
• Support designs through fabrication, assembly, review, and production release.

Required Qualifications

• 10+ years of relevant PCB board and/or package substrate layout experience preferred.
• Strong hands-on expertise with Cadence Allegro PCB Design.
• Experience designing complex high-speed and high-density multilayer PCBs.
• Strong experience with HDI PCB design, including technologies such as blind/buried vias, microvias, stacked microvias, or sequential lamination.
• Experience with fine-pitch BGA layouts and advanced component packages.
• Strong understanding of controlled impedance and transmission-line routing, including microstrip and stripline.
• Experience with Signal Integrity (SI) and high-speed routing practices.
• Strong understanding of PCB fabrication, assembly, DFM, and manufacturing tolerances.
• Experience working with PCB fabrication and manufacturing vendors.
• Knowledge of applicable IPC standards.

Preferred / Nice-to-Have Skills

• Package substrate or complex organic substrate layout experience.
• mSAP PCB layout experience.
• Cadence SiP experience.
• Experience with optical communication or networking hardware.
• Experience with optical pluggable products such as QSFP-DD, OSFP, or CFP2.
• Wire Bond component layout experience.
• Experience laying out high-current multiphase DC-DC power converters for processors or GPUs.
• Knowledge of IPC Class 2/3 and JEDEC standards.