PCB Layout Engineer

Maynard, MA, US • Posted 8 hours ago • Updated 8 hours ago
Contract W2
12 Months
No Travel Required
On-site
$60 - $70/hr
Fitment

Dice Job Match Score™

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Job Details

Skills

  • Allegro
  • Electrical Engineering
  • Manufacturing
  • PCB
  • PCB Design
  • Layout

Summary

The ideal candidate should have strong relevant and recent technical and hands-on background
and be able is hit the ground running as an individual contributor

  • Contribute to, or lead, PCB and package substrate layout development for leading-edge optical communication products. 
  • Ensure compliance with IPC standards, company design practices, and fabrication capabilities.
  • Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams.
  • Work with PCB fabricators, and substrate vendors to close DFMs.

Minimum Requirements

  • Bachelor’s degree or equivalent certifications with a minimum of 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering.
  • Expert-level proficiency with Cadence Allegro PCB design tools
  • Strong demonstrated working experience of complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies.
  • Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages.
  • Working understanding of transmission line layout geometries and rules (micro strip, strip line, CPW, etc.)
  • Demonstrated experience in layout of compact low voltage and high current multiphase DC-DC power converters for state-of-the-art processors and GPUs
  • Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances.
  • Demonstrated success delivering high-volume, high-reliability communication products under aggressive schedules.

Highly Desired Skills

  • Demonstrated experience with mSAP PCB layout design
  • Demonstrated experience with layout design of state of art optical pluggable products (CFP2, QSFP-DD, OSFP)
  • Proficiency in Cadence SiP tools and Substrate layout techniques
  • Proficiency in layout of designs with Wire Bond components
  • Strong understanding of PCB fabrication and assembly processes
  • Strong knowledge of relevant industry standards (IPC Class 2/3, JEDEC, etc.)
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: 91166803
  • Position Id: 9091569
  • Posted 8 hours ago
Contact the job poster
SS

Subhash Singh

Recruiter @ Recruitment.ai
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