Description
Develop advanced CMOS image sensor (CIS) process to meet performance targets under a defined schedule and budget.
Collaborate with foundry partners to define and improve the CIS silicon, color and package process for each CIS technology.
Provide support to production and design teams to improve yield and overall sensor performance, establishing process flow applicable to mass production.
Design and manage silicon split lots with respect to project goals and schedules to achieve performance targets, meet production requirements, and research and development of future technologies.
Analyze and interpret large volumes of bench and wafer level data; feedback to pixel and wafer split design to optimize design and improve performance.
Work in close collaboration with internal pixel design and characterization engineers, and external foundry partners; primary liaison between internal and external teams to drive effective technical communication and discussion.
Work with characterization engineers to analyze data and test results, provide feedback on evaluation methods and settings to improve testing efficiency and accuracy; coordinate evaluation schedule and equipment to enable testing.
Continuously track technology improvement and state of art developed by foundry; select and implement appropriate fabrication processes to meet CIS performance and yield targets; closely monitor lot processing and swiftly address/feedback any issues to foundry to mitigate product loss and schedule delay.
Requirements:
Master's degree or foreign equivalent degree in Electrical Engineering, Computer Engineering, or a related field.
Two years of experience in developing and fabricating semiconductor devices.
Required experience or skills in:
Developing and fabricating semiconductor devices, including designing and managing experimental splits to achieve performance targets.
Photolithography and microfabrication techniques (electron beam, thermal deposition, sputtering, reactive ion etching) in a clean room environment.
Silicon and semiconductor device testing, including electron microscopy (SEM, TEM), atomic force microscopy (AFM), spectroscopy techniques (photo- and fluoro- luminescence, Fourier transform IR spectroscopy, UV-vis), and optical and electrical device characterization.
Defining project roadmaps, performance targets, and schedules.
Annual base salary for this role in California, US is expected to be between $156,853 - $160,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
- Dice Id: 10119130
- Position Id: b4af78ee119bd6b0754396b96efc0228
- Posted 30+ days ago
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