Chandler, Arizona
•
5d ago
IC Packaging Design Engineer Experience: Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP) Candidates should have experience in the below domains: Physical Design & LayoutSubstrate design and layoutSI/PI aware design implementationDesign for performance, manufacturability, yield, and reliabilityDesign rule compliance
Easy Apply
Contract
55 - 65










