IC Packaging Design Engineer

IC Packaging Design Engineer LOC: Chandler, AZ or Hillsboro, OR (ONSITE) Longterm Contract 1 Year + No openings : 4 Skills Required Bachelors or Masters degree in Electrical /Electronics Engineering Experience: Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP) Candidates should have experience in the below domains: Physical Design & LayoutSubstrate design and layoutSI/PI aware design implementationDesign for p

Location: Tempe, AZ Salary: $65.00 USD Hourly - $80.00 USD Hourly Description: Our client is currently seeking a Senior Engineer, Packaging Engineering for a 6 month + contract. Looking for a packaging engineer with regulated industry packaging design. Must have experience: Regulated industry packaging design Regulated industry packaging Design Verification/validation Packaging test failure RCA experience Experience with packaging testing per ISO 11607 Nice to have: Supplier management

About Marvell Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleetin

About Marvell Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleetin