Chandler, Arizona
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Today
IC Packaging Design Engineer LOC: Chandler, AZ or Hillsboro, OR (ONSITE) Longterm Contract 1 Year + No openings : 4 Skills Required Bachelors or Masters degree in Electrical /Electronics Engineering Experience Tier: Senior-level (primary); Mid-level (secondary) Senior-Level: ~10+ years in IC packaging / package design Mid-Level: 46+ years (MS) or 6+ years (BS) in IC packaging / package design Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Adva
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Depends on Experience