This position involves independently driving the mechanical design of HPC server chassis – the physical frameworks that hold and cool high-end computing systems. The engineer creates 3D models and drawings of the chassis and its components, defines materials and thicknesses, and ensures that all server boards, power supplies, drives, and cooling elements fit together efficiently. Engineer collaborates with thermal experts to design airflow paths, heat sinks, fans, or liquid cooling loops that keep cutting-edge processors and GPUs within safe temperatures. Throughout the design cycle, this engineer will iterate designs based on simulation results and lab testing, balancing performance, cost, and manufacturability.
Work Experience
What you will bring
Proficiency in 3D CAD software for mechanical design using tools like PTC Creo, SolidWorks, or CATIA Strong knowledge of engineering materials (metals, plastics, composites) and their applications in chassis design Familiarity with manufacturing processes is critical strong analytical thinking to solve complex mechanical and thermal problems. The engineer must be adept at methods like tolerance analysis Excellent communication skills Prior work on HPC Chassis system or data center server hardware is highly valued, as it demonstrates familiarity with the unique challenges of high-power, high-density designs.
Good to have Skills:
Experience with high-density cooling solutions such as liquid cooling systems (cold plates, pumped liquid loops) or immersion cooling for electronics.
Insight into thermal management of GPCPUs (e.g., knowledge of heat flux challenges, two-phase cooling, or facility water-cooling hookups) Background in designing hardware for high-performance computing applications Knowledge of relevant standards and best practices in server and data center design like OCP, knowing ASHRAE TC 9.9 recommended practices for data center equipment thermal envelopes, or compliance with IEC/ISO standards related to electronic equipment.
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