Electrical Engineer (Semiconductor Equipment)

We’re seeking an experienced Electrical Engineer to support design, engineering change control, and build activities for complex semiconductor capital equipment. The role demands hands-on ownership of cable harness design, schematic development, documentation, and cross-functional coordination through formal change processes (ECO/ECN/VPR/QN).

Key Responsibilities

• Design & Documentation
• Develop and update electrical schematics, wiring diagrams, and cable harness designs using Pro/ENGINEER (Pro‑E/Creo).
• Create and maintain BOMs, part lists, and drawing packages; ensure drawing readability and GD&T awareness for electrical interfaces.
• Review, interpret, and redline engineering drawings;
• Change Control & Configuration Management
• Initiate and process ECO (Engineering Change Orders), ECN (Engineering Change Notices), VPR (Vendor Part Requests/Reviews), and QN (Quality Notifications) within Agile PLM and Windchill.
• Manufacturing & Onsite Support
• Provide onsite build support for semiconductor equipment—troubleshoot wiring issues, connector pinouts, interlocks, and power distribution.
• Collaborate with assembly teams to resolve design-for-manufacture (DFM) and design-for-service (DFS) concerns.
• Quality & Problem Solving
• Lead root cause analysis using structured problem-solving (8D, Fishbone, 5 Whys) and implement robust corrective/preventive actions.
• Address QNs, drive closure with measurable effectiveness; improve harness reliability and EMI/EMC performance where applicable.

Required Skills & Tools

• Electrical Design: Cable harnessing, wire routing, connector selection, grounding, shielding, safety interlocks.
• Schematics & CAD: Pro‑E/Creo for schematics and harness drawings; familiarity with ECAD–MCAD collaboration.
• PLM & PDM: Agile PLM and Windchill for change control, releases, and configuration management.
• Change Processes: Hands-on with ECO, ECN, VPR, QN workflows.
• Documentation: Strong drawing reading, redlining, revision control, and release practices.
• Problem Solving: Proven track record of resolving build issues quickly and permanently;
• Communication: Clear, concise communication with shopfloor teams and engineering stakeholders.

Nice-to-Have:

• Experience with semiconductor  equipment (vacuum systems, gas boxes, RF/power distribution, motion control).
• Exposure to EMC/EMI, safety standards (e.g., UL/CE), and industrial connectors
• Knowledge of DFM/DFS, Lean manufacturing, and design validation processes.
• Vendor interaction for harness manufacturing and first article inspection (FAI).

Behavioral Competencies:

• Ownership & accountability for deliverables and release quality.
• Attention to detail with strong configuration discipline.
• Onsite agility—hands-on, collaborative, and proactive.
• Structured problem solving and continuous improvement mindset.