Remote
•
Today
What You ll Do Own and execute hands-on mechanical, thermal, and multiphysics simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.Perform thermo-mechanical modeling, warpage analysis, CTE mismatch studies, stress/strain prediction, and thermal management optimization across chiplets, interposers, and substrates.Build and validate comprehensive ADK/PDK models (thermal, mechanical, reliability, electrical co-models) that accurately represent package-level behav
Easy Apply
Full-time
Depends on Experience
