2.5D Jobs in Austin, TX

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Microelectronics Advanced Packaging SME

Booz Allen Hamilton

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Remote

Full-time

Job Number: R0216856 Microelectronics Advanced Packaging SME Key Role: Provide technical leadership and subject matter expertise to U.S. government clients in the areas of advanced microelectronics packaging technologies, including silicon interposer assemblies, flip chip, BGA, advanced interconnect, multi-chip modules, and 2.5D or 3D heterogenous integration. Identify and assess the performance of packaging providers and technologies against defense needs and requirements. Define strategies and
Posted 14 days ago | Updated 7 hours ago

Signal Integrity and Power Integrity Application Engineer

Cadence Design Systems Inc

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Austin, Texas, USA

Full-time

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. The candidate will work closely with Sales Account Managers and technical field application engineers supporting technical campaigns by delivering workshops, product demonstrations, training, and onsite support. The candidate will have good knowledge of the Cadence toolset and/or equivalent competitor toolsets in the context of multiple flows including high-speed signal design, power de
Posted 17 days ago | Updated 6 hours ago

PCB Layout Engineer

Randstad Digital

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Remote or Phoenix, Arizona, USA

Contract

job summary: Exciting opportunity for an experienced Principal PCB & Substrate Layout Engineer to join a growing, engaging, and collaborative team. As a valued team member, you will collaborate to deliver leading edge microelectronics that are game changing and impactful to our nation's defense. The successful candidate will be part of a dynamic team that is transforming the business and the defense-grade microelectronics industry while executing on near-term program commitments while fosteri