2.5D Jobs in Baltimore, MD

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Microelectronics Advanced Packaging SME

Booz Allen Hamilton

•

Remote

Full-time

Job Number: R0216856 Microelectronics Advanced Packaging SME Key Role: Provide technical leadership and subject matter expertise to U.S. government clients in the areas of advanced microelectronics packaging technologies, including silicon interposer assemblies, flip chip, BGA, advanced interconnect, multi-chip modules, and 2.5D or 3D heterogenous integration. Identify and assess the performance of packaging providers and technologies against defense needs and requirements. Define strategies and
Posted 14 days ago | Updated 3 hours ago

PCB Layout Engineer

Randstad Digital

•

Remote or Phoenix, Arizona, USA

Contract

job summary: Exciting opportunity for an experienced Principal PCB & Substrate Layout Engineer to join a growing, engaging, and collaborative team. As a valued team member, you will collaborate to deliver leading edge microelectronics that are game changing and impactful to our nation's defense. The successful candidate will be part of a dynamic team that is transforming the business and the defense-grade microelectronics industry while executing on near-term program commitments while fosteri