Mechanical FEA Engineer

Job Title: Mechanical FEA Engineer

Job Location: Fremont, CA

Interview: Virtual

Job Duration: 6+ Months

Responsibilities:

• Perform static structural Finite Element Analysis (FEA) for hardware accelerator modules, focusing on stiffener design, rib layouts, thickness, geometry, mounting locations, and material selection.
• Analyze mounting pressure, gravity sag, and handling load conditions to evaluate structural performance.
• Conduct random vibration, sine sweep, shock, and drop simulations to assess hardware reliability during transportation and operation.
• Perform modal analysis and evaluate fatigue, yield, and structural failure risks.
• Execute PCB and PCBA warpage simulations across different assembly stages, including bare PCB, populated components, and complete PCBA at room and elevated temperatures.
• Evaluate thermal expansion (CTE mismatch), assembly effects, and package warpage to identify potential SMT manufacturing risks.
• Develop simulation models, meshing strategies, analysis plans, and detailed technical reports.
• Validate simulation results against physical testing, including shadow-moir measurements, shaker testing, and drop testing.
• Refine FEA models based on test correlation and report results against defined acceptance criteria.

Must Haves:

• 5+ years of hands-on structural FEA experience in electronics, PCB/PCBA, or semiconductor packaging.
• Strong experience with ANSYS and/or Altair HyperMesh for structural simulation and analysis.
• Hands-on experience with PCB/PCBA warpage simulation, including thermal expansion, CTE mismatch, and assembly/reflow effects.
• Experience performing shock, vibration, drop, modal, and fatigue analysis.
• Strong understanding of mechanical stress, strain, deformation, and structural reliability.
• Experience correlating simulation results with physical test data and refining analytical models.
• Ability to independently execute defined simulation load cases and prepare technical reports against acceptance criteria.

Nice to Haves

• Experience supporting server hardware, AI accelerator modules, or advanced electronic packaging.
• Familiarity with SMT processes and package-level warpage evaluation.
• Experience with shadow-moir testing and mechanical reliability validation.
• Knowledge of thermal-mechanical interactions in electronic assemblies.
• Experience working with hardware design, manufacturing, and testing teams.