Thermal Engineer

Apple is where individual imaginations gather together, committing to the values that lead to great work. Every new product we build, service we create, or Apple Store experience we deliver is the result of us making each other's ideas stronger. That happens because every one of us shares a belief that we can make something wonderful and share it with the world, changing lives for the better. It's the diversity of our people and their thinking that inspires the innovation that runs through everything we do. When we bring everybody in, we can do the best work of our lives. Here, you'll do more than join something - you'll add something.\\n\\nWe are seeking Mechanical Engineer to lead the design, development, and validation of silicon validation test solutions and provide system design support to other Apple engineering teams.

This design engineer will be responsible for the end-to-end mechanical development of electromechanical systems for silicon validation, with responsibilities including:\n-Defining mechanical requirement and interface for high power electromechanical systems\n-Conducting cross functional design reviews and generate mechanical requirement documents\n-Designing board and system level mechanical assemblies and generate drawings, BOMs and assembly instructions\n-Defining mechanical component outlines and component keep outs for PCB layouts\n-Performing dimensional and tolerance analysis\n-Managing and tracking multiple priorities within schedule requirements\n-Design validation and characterization from prototype bring-up to product testing\n-Driving failure analyses and design of experiments (DOEs) to reach design solutions and corrective actions.

Bachelors in Mechanical Engineering or equivalent study with 10+ years of experience. \n5+ year of 3D CAD experience required.\nGood understanding of mechanical fabrication processes and be able to determine the best method for given design\nDisciplined in GD&T practices and must be able to perform Tolerance Analysis of complex assemblies\nExperience of designing various types of heat sinks and cooling solutions for high power ASICs including Liquid cooling\nExperience of designing equipment for data centers and good understanding of EIA Rack Standards and OCP standard\nMust be able to generate MCO for PCBs, create assembly drawings, BOMs and familiar with PDM tools such as Agile\nApplied knowledge in interconnect technologies including signal integrity, printed circuit boards, material science and basic chemistry of connectors\nExcellent written and verbal communication skills and people skills; ability to interact with management, team members and external vendors\nTeamwork: the candidate must be able to communicate well with cross functional team members, be able to efficiently collaborate with team members to achieve project goals, and contribute positively to the engineering community.

10+ years of hands-on product design experience in electronic products or modules, direct fixture design experience\nExperience with MCAD-ECAD file exchange and IDX processes\n3+ years of experience of NX 3D CAD tool & Team Center\n5+ years of experience in computer, server or networking equipment industries\n3+ years of experience designing liquid cooled board assemblies and systems\n3+ years of experience in data center products and good understanding of EIA\nRack Standards and OCP standards\nMSME degree is preferred.