Sr. Semiconductor Package Design Engineer
Oxford Global Resources
Dice Job Match Score™
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Job Details
Skills
- Semiconductor package design
- IC package design
- package substrate layout
- semiconductor package substrate physical design and layout
- signal integrity
- power integrity
- electrical model extraction
- semiconductor packages
- high-speed interconnects
- bump maps
- ball maps
- layer stack-ups
- package substrates
- ic package structures
- ansys hfss
- ansys electromagnetic-analysis
- advanced semiconductor package
- 2.5 packaging
- 3d packaging
- interposers
- chiplets
- rdl out
- fan-out
- high-performance package
- package designs
Summary
Job Title: Sr. Semiconductor Package Design Engineer
Location: Boxborough, MA - Onsite
Duration: 12 months; potential for extension based on project needs
Target Start Date: ASAP / based on candidate availability
Job Description:
We are seeking a Sr. Semiconductor Package Design Engineer with extensive experience designing and analyzing IC package substrates for high-performance semiconductor applications. This individual will support package development from early architecture and requirements definition through physical substrate layout, electrical model extraction, analysis, and final design completion.
The ideal candidate combines hands-on semiconductor package substrate design and layout with strong signal-integrity and power-integrity fundamentals. Experience with Ansys HFSS or related Ansys electromagnetic-analysis tools is highly preferred.
Key Responsibilities:
Lead and perform hands-on semiconductor package substrate design and layout while ensuring packages meet signal-integrity, power-integrity, and electrical-performance requirements. Support package architecture decisions, electrical model extraction, analysis, and design progression from initial requirements through final completion.
Required Experience:
10+ years of semiconductor / IC package design, package substrate layout, or closely related experience
Hands-on semiconductor package substrate physical design and layout
Experience with signal integrity, power integrity, and electrical model extraction for semiconductor packages or high-speed interconnects
Experience defining or working with bump maps, ball maps, layer stack-ups, package substrates, or similar IC-package structures
Preferred / Standout Experience:
Ansys HFSS or other Ansys electromagnetic-analysis experience — strong preference
Advanced semiconductor package experience involving 2.5D/3D packaging, interposers, chiplets, RDL/fan-out, or other high-performance package technologies
Experience taking multiple semiconductor package designs from architecture through layout, analysis, and design release
- Dice Id: cxoxpma
- Position Id: 9097614
- Posted 30+ days ago
Company Info
Why work with Oxford?
We provide you with the flexibility and support you need to thrive. How? By getting to know you. Our dedicated recruiters will take the time to understand your unique goals and match you with opportunities that support them. At Oxford, we’re all about you.
More about Oxford:
Oxford Global Resources delivers tailored solutions for any technical challenges you face using our partnership-first approach. We specialize in workforce mobilization, digital transformation, and modern enterprise. We are committed to providing you with The Right Talent. Right Now.
In 1984, we started Oxford with a handful of employees in a converted schoolhouse in Reading, Massachusetts. The people that shape our organization are some of the best in the industry. They are dedicated to making an impact and are with you every step of the way. We strive to meet the most pressing needs, solve the most complex problems, and go beyond expectations for our clients and our consultants. Together, we drive great outcomes.
