Mechanical Design Engineer / Mechanical Engineer

Job Title: Mechanical Design Engineer HPC Server Chassis

Mandatory Skills

• Prior experience working on HPC chassis systems or data center server hardware, including server room level design considerations.

What You Will Do

• Independently drive the mechanical design of HPC server chassis, which serve as the physical framework for high-performance computing systems.

• Develop detailed 3D CAD models and engineering drawings for chassis assemblies and individual components.

• Define materials, gauges, and structural thicknesses to meet performance, cost, and manufacturability targets.

• Ensure seamless integration and fitment of server boards, power supplies, storage devices, and cooling components.

• Collaborate closely with thermal engineering teams to design effective cooling solutions, including optimized airflow paths, heat sinks, fans, and liquid cooling loops.

• Iterate chassis designs based on thermal simulations, structural analysis, and lab validation testing.

• Balance thermal performance, mechanical integrity, cost efficiency, and manufacturability throughout the product development lifecycle.

• Support prototype builds, testing, and design refinement during development and validation phases.

Work Experience / What You Will Bring

• Proficiency in 3D CAD software such as PTC Creo, SolidWorks, or CATIA for mechanical design.

• Strong knowledge of engineering materials (metals, plastics, composites) and their application in chassis and enclosure design.

• Solid understanding of manufacturing processes, including sheet metal fabrication, machining, and assembly methods.

• Strong analytical and problem-solving skills, particularly for complex mechanical and thermal challenges.

• Experience with tolerance analysis and design for manufacturability (DFM).

• Excellent verbal and written communication skills for cross-functional collaboration.

• Prior experience with HPC chassis systems or data center server hardware is highly valued, demonstrating familiarity with high-power, high-density design constraints.

Good-to-Have Skills

• Experience designing high-density cooling solutions, including:

  • Liquid cooling systems (cold plates, pumped liquid loops)

  • Immersion cooling for electronics

• Understanding of GPU/CPU thermal management, including heat flux challenges, two-phase cooling concepts, and facility water-cooling interfaces.

• Background in high-performance computing (HPC) hardware design.

• Knowledge of industry standards and best practices for server and data center design, such as:

  • Open Compute Project (OCP) specifications

  • ASHRAE TC 9.9 thermal guidelines for data center equipment

  • Relevant IEC/ISO standards for electronic equipment compliance