RFIC Design with Strong Power Amplifier

Hybrid in San Diego, CA, US • Posted 1 day ago • Updated 1 day ago
Full Time
Hybrid
$180,000 - $255,000/yr
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Job Details

Skills

  • RFIC
  • 3GPP
  • ADS
  • EDA
  • Electrical Engineering
  • Innovation
  • Integrated Circuit
  • Intellectual Property
  • Microwave
  • Patents
  • RF
  • Semiconductors

Summary

RFIC Design with strong Power Amplifier exp.
San Diego
Hybrid Flex if manager likes them
Any Visa
Job Description:
Key Responsibilities
IP Development: Identify and document novel circuit architectures and design
techniques to contribute to Finwave s growing Intellectual Property (IP) portfolio.
Technology Integration: Utilize Finwave s E-Mode GaN-on-Si processes to
achieve breakthroughs in power density and energy efficiency for 5G/6G and
SATCOM CPE.
Advanced PA Design: Execute high-performance MMIC/Hybrid PA designs for
mobile RF front ends, optimized for Envelope Tracking (ET) and Average Power
Tracking (APT) operation.
End-to-End Development: Contribute to the full design lifecycle, including
architecture support, tape-out, prototype characterization, and debugging for high-
volume production
Collaboration: Work cross-functionally to document designs and ensure thermal
management strategies are integrated into high-power density applications.
Qualifications & Skills
Education: Master s or PhD in Electrical Engineering, RF/Microwave Engineering,
or Physics.
Experience: 20+ years of experience in RF semiconductor design, with a proven
track record of shipping high-volume PA products for the global smartphone market.
Strong teamwork, communication, organization, and documentation skills.
Industry Standards: In-depth understanding of RFFE requirements for Tier-1
smartphone OEMs and current 3GPP standards.
Innovation Mindset: Proven ability to develop creative solutions for complex RF
challenges, supporting the generation of internal design specs and patents.
Technical Expertise
Device Physics: Mastery of GaN (preferred), III/V (GaAs) or SOI. compound
semiconductor device physics and advanced modeling.
Thermal Design: Deep understanding of thermal management strategies for high-
power density applications in a flip-chip configuration.
EDA Tools: Expert proficiency in Keysight ADS and Ansys HFSS for MMIC and
laminate co-simulation.
Linearity Management: Expertise in managing the trade-offs between Noise
Figure, Gain, and Input Third-Order Intercept Point (IIP3) for high-performance
mobile RFFEs.
Hands-on experience with RF/microwave test equipment such as network
analyzer, probe station, source/load pull system, noise figure measurements, and/or
signal sources/analyzers that deal with modulated signals.
Familiarity with Noise Theory is a plus: Design Low Noise Amplifier (LNA),
including impedance matching and impact of parasitic losses on the Noise Figure
(NF).
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: 10308440
  • Position Id: 9008168
  • Posted 1 day ago

Company Info

About Technical Link

Technical-Link North America is dedicated to excellence in engineering staffing, connecting top talent with leading companies. Whether you're an employer seeking skilled engineers or an engineer looking for your next contract opportunity, we have the expertise and resources to meet your needs.

Contact the job poster
LS

Lekenzey Siddell

Recruiter @ Technical Link
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