Electrical PCB Design Engineer || Phoenix, Arizona - Onsite

Job Description: 

TOP 3 must haves for this role:

• Substrate development; Expert in Cadence APD+; Expert in substrate design rules
   
• High-Speed Interfaces and High Density Substrates layout techniques and understanding and improving our layout development processes to ensure we produce quality products using your expertise in PCB and Substrate layout engineering.

• BS and 10+ years as a PCB and/or High-Density Package Layout designer using industry standard layout tools like Cadence APD+
• High-density interposers, substrates, and PCB layouts: power, digital, analog, and RF signals across multiple die (primarily flip-chip)

• Hands on high-speed, multi-layer packaging, high-density interconnects (HDI), blind and buried vias, ball grid arrays (BGAs), RF, design for test (DFT), impedance calculations, cross talk, differential pairs, PCB stack-ups, PCB via structures, electromagnetic compatibility (EMC), material studies/selection, etc.
• Support package material characterization frequency dependent model; skin effects, smoothness, roughness, dielectric loss and dielectric constant
• Experience with APD+ physical and electrical constraint editor
• HDI stack-ups, including use of blind & buried micro-vias, specialty RF dielectric materials, and trace width/spacing around 15um/15um down to 2um/2um or below
• Experience with 2.5D devices, interposer or substrate design, flip-chip, surface mount, die stacking, package stacking, substrate stacking and other techniques
• Cadence schematic / netlist driven CAD layout process, e.g. Cadence APD+ (Allegro) and supporting tools
• High-end FPGA package or board design experience
• Ability to work with our Mechanical team to design full 3D models for fit checks and thermal
• Understanding of layout techniques in Digital, Analog, and/or RF layouts
• Electronic packaging techniques; CAM package for manufacturing data validation (CAM350 & Blueprint)
• JEDEC /IPC design, fabrication, and assembly specifications

Creating assembly documentation and fabrication deliverables per company and industry standards