Seeking a Senior SRAM Layout Design Engineer to own the complete custom layout process for SRAM bitcell arrays, memory periphery, test structures, and memory macros in advanced CMOS technologies at the leading edge of process scaling. This is a senior individual-contributor role you'll own and contribute blocks alongside an established team of leads, not manage one. The role works closely with circuit design, PnR/integration, CAD, and foundry teams to deliver consistent, high-quality memory IP on advanced FinFET/GAA nodes, and includes reviewing layouts and mentoring junior engineers to raise layout quality and execution rigor across the team.
This project is at the start of a 1 1.5 year technology cadence rather than a short-cycle tapeout crunch, giving the team real runway to ramp onto a brand-new, still-stabilizing process node a genuine draw for engineers who want to work at the cutting edge.
Key Responsibilities
Manage the complete custom layout process for SRAM bitcell arrays, memory periphery, test structures, and memory macros in advanced CMOS technologies.
Develop and improve floorplans for SRAM and memory blocks, covering array layout, periphery positioning, power grid design, routing channels, and macro assembly.
Carry out, debug, and complete DRC, LVS, ERC, antenna, and associated physical verification checks with tools such as Calibre, ICV, or similar workflows.
Support EM/IR review, power integrity, density/fill, DFM, dummy insertion, layout-dependent effects, and other requirements for tapeout.
Collaborate with circuit designers to convert schematics into layouts, ensuring matching, symmetry, shielding, parasitic targets, and reliability constraints are maintained.
Collaborate with PnR and integration teams to resolve top-level DRC/LVS, pin access, boundary, routing, power-grid, and macro-integration issues.
Implement and advance layout methodology, checklists, reusable practices, and quality standards for consistent memory IP delivery.
Collaborate with foundry, CAD, and methodology teams on rule interpretation, deck behavior, waivers, and advanced-node process constraints.
Review layouts, mentor junior engineers, and help raise layout quality and execution rigor across the team.
Required Qualifications
BSEE or equivalent experience.
10+ years of hands-on custom IC layout experience as a senior individual contributor (this is not a lead/people-management role), including 5+ years in SRAM, memory compiler, or full-custom memory IP layout.
Hands-on, personal ownership of custom digital SRAM layout candidates must have directly executed the layout themselves, not simply overseen or reviewed it. This role is not a fit for mixed-signal or analog layout backgrounds.
Hands-on experience at TSMC 3nm or a more advanced process node. Experience limited to 10nm or 7nm does not meet the bar for this role; 5nm is a plus, but 3nm is the minimum.
Solid grasp of SRAM and memory layout principles.
Extensive experience in Cadence Virtuoso applied to custom layout creation and assessment.
Extensive experience in DRC/LVS debugging using Calibre, ICV, or similar physical verification tools.
Experience with floor planning, block-level routing, macro assembly, pin planning, boundary/interface management, and top-level physical verification.
Direct familiarity with advanced-node layout limitations and layout-dependent phenomena, including LOD, density/fill, matching, symmetry, shielding, electromigration, IR drop, and DFM or similar expertise.
Ability to work effectively with circuit build, physical build, integration, CAD, and foundry teams.
Clear communication, strong ownership, good judgment, and the ability to mentor other engineers.
Preferred Qualifications
Background at TSMC, Intel, Samsung, or Micron (foundries or memory companies with their own advanced process nodes) is strongly preferred TSMC alumni in particular.
Experience on TSMC's next-generation, beyond-3nm process nodes.
Knowledge of, or demonstrated motivation to learn, AI-assisted layout automation tools
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