Job Description
As a Module Development Engineer, you will be integral to advancing Intel's manufacturing processes and semiconductor technology. You will lead efforts in the development and optimization of cutting-edge defect inspection tools and advanced manufacturing solutions. This role empowers you to influence high-volume manufacturing, drive technology pathfinding initiatives, and shape the future of Intel's industry-leading innovations. Collaborating with key equipment and material suppliers, you will help develop solutions that align with Intel's future roadmap, ensuring cost efficiency, scalability, and industry leadership.
Key Responsibilities
- Design, develop, and optimize advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Lead feasibility studies and pathfinding activities to innovate device architectures and align with next-generation roadmaps.
- Develop and implement defect inspection technologies for high-volume manufacturing and future technology processes.
- Partner with equipment and material suppliers to implement enabling technologies that support Intel's strategic goals.
- Recommend and execute modifications to improve equipment performance, optimize production efficiency, and enhance manufacturing techniques.
- Conduct process technology feasibility studies using theoretical simulations and practical engineering methods.
- Stay informed on industry trends and advancements to shape Intel's semiconductor technology needs.
- Develop cost-sensitive technology roadmaps by collaborating with vendors to push industry boundaries.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This position is not eligible for Intel immigration sponsorship.
Minimum Qualifications
Preferred Qualifications
Master's degree or PhD in Mechanical Engineering, Electrical Engineering or STEM related field.
Experience in Advanced Packaging
Demonstrated ability to troubleshoot manufacturing processes and equipment.
Experience with packaging processes, equipment automation development, or project management.
Strong problem-solving skills, adaptability, and ability to manage multiple tasks effectively.
Passionate about contributing to Intel's strategic advancements and driving meaningful industry innovation.
We invite you to bring your expertise and creativity to Intel, where you will have the opportunity to innovate, collaborate, and shape the future of semiconductor technology. Apply now and join our dynamic team.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits
Annual Salary Range for jobs which could be performed in the US $109,600.00-$154,800.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.
* Job posting details (such as work model, location or time type) are subject to change.
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