RFIC Engineer

San Diego, CA, US • Posted 1 day ago • Updated 1 day ago
Contract Independent
Contract W2
12 Months
No Travel Required
On-site
Depends on Experience
Company Branding Image
Fitment

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Job Details

Skills

  • Power Amplifier
  • RFIC
  • RF
  • Semiconductors

Summary

Job Description

Key Responsibilities

  • IP Development: Identify and document novel circuit architectures and design techniques to contribute to the company''s growing Intellectual Property (IP) portfolio.

  • Technology Integration: Utilize E-Mode GaN-on-Si processes to achieve breakthroughs in power density and energy efficiency for 5G/6G and SATCOM CPE.

  • Advanced PA Design: Execute high-performance MMIC/Hybrid PA designs for mobile RF front ends, optimized for Envelope Tracking (ET) and Average Power Tracking (APT) operation.

  • End-to-End Development: Contribute to the full design lifecycle, including architecture support, tape-out, prototype characterization, and debugging for high-volume production.

  • Collaboration: Work cross-functionally to document designs and ensure thermal management strategies are integrated into high-power density applications.

Qualifications & Skills

  • Master''s or PhD in Electrical Engineering, RF/Microwave Engineering, or Physics.

  • 20+ years of experience in RF semiconductor design, with a proven track record of shipping high-volume PA products for the global smartphone market.

  • Strong teamwork, communication, organization, and documentation skills.

  • In-depth understanding of RFFE requirements for Tier-1 smartphone OEMs and current 3GPP standards.

  • Proven ability to develop creative solutions for complex RF challenges, supporting the development of internal design specifications and patentable innovations.

Technical Expertise

  • Device Physics: Mastery of GaN (preferred), III/V (GaAs), or SOI compound semiconductor device physics and advanced modeling.

  • Thermal Design: Deep understanding of thermal management strategies for high-power density applications in flip-chip configurations.

  • EDA Tools: Expert proficiency with Keysight ADS and Ansys HFSS for MMIC and laminate co-simulation.

  • Linearity Management: Expertise in balancing Noise Figure (NF), Gain, and Input Third-Order Intercept Point (IIP3) for high-performance mobile RF front ends.

  • Hands-on experience with RF/microwave test equipment, including network analyzers, probe stations, source/load pull systems, noise figure measurement equipment, and signal sources/analyzers for modulated signals.

  • Familiarity with noise theory is a plus, including Low Noise Amplifier (LNA) design, impedance matching, and understanding the impact of parasitic losses on Noise Figure (NF).

Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: 10308440
  • Position Id: 9031236
  • Posted 1 day ago

Company Info

About Technical Link

Technical-Link North America is dedicated to excellence in engineering staffing, connecting top talent with leading companies. Whether you're an employer seeking skilled engineers or an engineer looking for your next contract opportunity, we have the expertise and resources to meet your needs.

Contact the job poster
JA

Jeff Anderson

Recruiter @ Technical Link
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