Advanced Package Development Engineer

San Francisco, CA, US • Posted 18 hours ago • Updated 5 hours ago
Full Time
On-site
Fitment

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Job Details

Skills

  • MASS
  • Semiconductors
  • Process Integration
  • Bonds
  • Logistics Management
  • CMOS
  • Electrical Engineering
  • Mechanical Engineering
  • Failure Analysis
  • JMP
  • Ansys
  • Research and Development
  • Cross-functional Team
  • Communication

Summary

Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products.\\nIn this role, you'll contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You'll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.

Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology development.\n\nWe're looking for someone who:\n Has deep expertise in semiconductor packaging or related disciplines\n Thrives on solving difficult technical problems\n Holds themselves to a high standard of engineering excellence\n Is self-motivated and comfortable navigating ambiguity

BS and 10+ years of experience in relevant industry experience.

PhD and 6+ years of experience in relevant industry preferred.\nSilicon fab interconnect process integration experience in BEoL process, RDL, fine pitch ?-bumps, hybrid bonds, TSVs, etc.\nDeep knowledge of electrical, mechanical and thermal properties of fab materials.\nStrong expertise in Si Fab equipment and Fab Logistics Management.\nExperience on advanced packaging for groundbreaking CMOS nodes.\nExpertise on Si structure yield and reliability mechanisms and analyses.\nGood familiarity with electrical, mechanical and/or thermal characterization, failure analysis.\nTool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT.\nCapable of independent R&D Work in a cross-functional team, driving vendors.\nExcellent communication skills.\nExperience in Si fab integration role and advanced packaging.
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: 90733111
  • Position Id: c50f690c2cccd73056f83df321805f07
  • Posted 18 hours ago
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