Embedded Design Engineering Intern - Firmware

Leidos Defense Systems, is seeking a talented Embedded Design Engineering Intern to join a diverse team to create unique solutions for complex problems. We have offices across the United States that provide responsive, cost-effective engineering, scientific, and IT solutions in the defense, space, cyber, and commercial fields. The ideal candidate will thrive in a learning environment that encourages leadership and technical growth.

At Leidos, our mission is to reach, equip, and teach students with an interest in the field of defense and aerospace. Running for over two decades, the internship program has been a staple at Leidos, giving interns hands-on experience in their future career path. With no shortage of work available, interning with Leidos promises growth, experience, and unrivaled opportunity across the US.

This position is an Embedded Design Engineering Intern in the Electrical Systems Department. The selected candidate will have an opportunity to experience and learn about all phases of the product life cycle from concept development and detailed design through manufacturing, integration, testing, and post-delivery support. Additional learning opportunities related to digital-signal processing (DSP) design, printed circuit board (PCB) design, experience with technical trade studies, and evaluation of technology improvements will be provided to the engineering student through this internship.

Primary Responsibilities

• Designing embedded software and firmware
• Performing HDL simulations and software unit tests
• Hands-on laboratory testing with instrumentation, test equipment, and debug/test methods
• Performing in a collaborative engineering environment working closely with multi-disciplinary teams
• Working with platforms such as FPGAs, microcontrollers, microprocessors, and mixed signal designs.

Basic Qualifications

• Currently enrolled in an accredited college / university and currently working towards a degree in Computer Engineering or a related field.
• Experience with C, C++, or Rust embedded software programming through course work, lab projects, and previous internships.
• Demonstrates problem solving, teamwork, and communication skills.
• Holds a GPA of 3.0 or higher.
• Includes resume and unofficial transcripts in application.

Preferred Qualifications

Preference shown to candidates who have experience and/or working knowledge of:

• Utilizing modern Xilinx FPGA and SoC families and design tools (RFSoC, Xilinx IP Cores, AXI4, AXI-Stream)
• Basic knowledge of FPGA/Firmware languages (VHDL, Verilog, SystemVerilog, assembly, Rust)
• Experience with simulation and test frameworks
• RISC microprocessors architectures (ARM Cortex, Microblaze, PowerPC, RISC-V)
• Memory architectures, types, and caching
• GNU/Linux and developing kernel drivers
• Communication protocols such as: UART, Ethernet, SPI, I2C, CAN bus, etc.
• Embedded operating systems (Linux, VxWorks, Integrity, FreeRTOS, Zephyr, uC/OS-II)
• Electronics and PCBA design
• Leading design teams including technical leadership, budgeting, and scheduling

If you're looking for comfort, keep scrolling. At Leidos, we outthink, outbuild, and outpace the status quo - because the mission demands it. We're not hiring followers. We're recruiting the ones who disrupt, provoke, and refuse to fail. Step 10 is ancient history. We're already at step 30 - and moving faster than anyone else dares.

Original Posting:
January 30, 2026

For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.

Pay Range:
Pay Range $48,100.00 - $86,950.00

The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.