System Design Engineer

San Francisco, CA, US • Posted 14 hours ago • Updated 1 hour ago
Full Time
On-site
Fitment

Dice Job Match Score™

⭐ Evaluating experience...

Job Details

Skills

  • Electrical Engineering
  • Product Development
  • Cross-functional Team
  • System Requirements
  • Optimization
  • Systems Design
  • Feasibility Study
  • Circuit Design
  • Schematic Capture
  • System Integration
  • Signal Integrity
  • Cadence
  • Allegro
  • Physical Data Model
  • PCB
  • Integrated Circuit
  • FC

Summary

Do you love working on challenges that no one has solved yet? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. In this role, you will own and drive the electrical and physical design of multi-layer boards for prototype systems, developing reference designs that meet stringent area, cost, and performance requirements for product development.

Work with cross-functional team to understand system requirements, from both physical design limitations and performance requirements Develop physical design implementations meeting stringent power and signal integrity requirement Drive co-optimization of physical design on MLB and package Provide implementation guidelines and feedback to silicon, package, and system design groups Perform feasibility study, design verification, and sign-off.

BS and 10+ years of relevant industry experience

4+ years experience in physical design of multi-layer boards (MLBs).\nExperience in circuit design, schematic capture, and system integration.\nStrong physical understanding of power and signal integrity fundamentals. \nExperience in the physical design of Power Delivery Networks (PDNs) and high-speed signals at PCB level. \nFamiliar with Cadence APD/Allegro for physical design. \nFamiliar with High Density Interconnect (HDI) PCB and Flip-Chip (FC) BGA package substrate technologies. Ability to work and communicate effectively in a multi-functional team.
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: 90733111
  • Position Id: 4b72a46fce696062f749b7c2b8d31150
  • Posted 14 hours ago
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