Senior Electrical Engineer - Advanced Semiconductor Packaging and Integration

Job Description: Senior Electrical Engineer - Advanced Semiconductor Packaging and Integration

Company Overview
Join our team and be at the forefront of semiconductor technology innovation. We are looking for a highly skilled Senior Engineer to contribute to our cutting-edge projects in Advanced Semiconductor Packaging and AI. You will work alongside some of the brightest minds in the industry and have the opportunity to make a significant impact on the future of AI.
Position Overview
We are seeking a Senior Electrical Engineer with a strong background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will have extensive knowledge in mixed-signal design, chiplet design, and advanced packaging, with a deep understanding of BEOL and FEOL semiconductor processing.
Responsibilities

• Lead the design and development of advanced semiconductor electronics and ASICs.
• Develop and optimize mixed-signal designs.
• Oversee semiconductor processing and advanced packaging technologies.
• Integrate HBM and LPDDR memory into system designs.
• Implement chiplet integration techniques focusing on high-speed chiplet I/O.
• Ensure signal and power integrity throughout the design process.
• utomate chip layout generation and format conversion.
• Design PCBs with a focus on performance and reliability.
• Conduct thermal simulations for optimal thermal management.
• Substrate design and documentation.
• Top-Level system design and floorplan.
• Overall ASIC and Chiplet design flow.
• rchitecture documentation.
• EDA tools setup.
• Collaborate with cross-functional teams for seamless integration and timely delivery.
• Mentor and guide junior engineers.

Requirements

• M.S in Electrical Engineering, Computer Engineering, or a related field.
• Extensive experience in advanced semiconductor electronics and ASIC design.
• Proficiency in mixed-signal design and semiconductor processing techniques.
• Strong knowledge of advanced packaging technologies, including HBM and LPDDR integration.
• Experience with chiplet integration and high-speed chiplet I/O.
• Expertise in signal integrity, power integrity, and automated chip layout generation.
• Proven track record in PCB design and thermal simulations.
• Excellent leadership, communication, and project management skills.

Preferred Qualifications

• Ph.D. in a relevant field.
• Experience with leading industry-standard design and simulation tools.
• Published works or patents in semiconductor technologies.