About Analog DevicesAnalog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible . Learn more at and on LinkedIn and Twitter (X).
We are seeking a highly motivated and experienced Staff Packaging Engineer to lead and support advanced semiconductor package development for ADI's smart switch products and other power devices.
Key Responsibilities- Lead the package design, material selection, simulation, process development, qualification, and release-to-manufacturing to deliver robust, cost-effective packaging solutions.
- Collaborate with cross-functional teams including business units, product engineering, reliability, and supply chain to define packaging needs and drive solutions from concept through production.
- Interface with OSATs and vendors for new package development, design iterations, prototype builds, and process optimization.
- Lead reliability assessments, failure analysis, and qualification activities to ensure product robustness in harsh operating environments.
- Manage multiple packaging development projects with ownership of schedule, quality, and technical deliverables.
Minimum Qualifications- Master's degree in Mechanical Engineering, Materials Science, or Electrical Engineering.
- 5+ years of relevant experience in IC or power packaging, preferably involving SiC or GaN power device packaging.
- Strong understanding of packaging materials, mechanical design principles, and thermal management techniques.
- Experience with package reliability requirements, failure analysis techniques, and assembly process development.
- Familiarity with process control methodologies such as FMEA, DOE, SPC, and PCN.
- Excellent project management, communication, and cross-functional collaboration skills.
- Experience managing OSATs and external suppliers for NPI and high-volume production.
- Experience with power module or high-voltage packaging for automotive applications is a plus.
- Hands-on experience with FEA tools (e.g., ANSYS Mechanical, FloTHERM) and 3D CAD modeling (e.g., SolidWorks) is a plus.
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position - except s, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) - may have to go through an export licensing review process.
Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
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Job Req Type: Experienced
Required Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $106,500 to $159,750.
- Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
- This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
- This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
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