Senior Engineer I, AS Field Application

Fort Washington, PA, US • Posted 30+ days ago • Updated 2 hours ago
Full Time
On-site
Fitment

Dice Job Match Score™

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Job Details

Skills

  • Repair
  • Preventive Maintenance
  • Project Management
  • Performance Management
  • SAP BASIS
  • Presentations
  • Collaboration
  • Reporting
  • Documentation
  • Continuous Improvement
  • Assembly
  • Systems Design
  • Mechanical Engineering
  • Electrical Engineering
  • Physics
  • Semiconductors
  • Integrated Circuit
  • Semiconductor Fabrication
  • Data Analysis

Summary

Responsibilities

  • Work closely with our customers to develop and optimize advanced packaging processes for semiconductor manufacturing
  • Serve as the lead technical interface for customers, helping them develop and optimize their packaging recipes
  • Troubleshoot and repair semiconductor packaging equipment, perform preventive maintenance (PM) on the machines when needed and train the customer engineers to use the equipment
  • Communicate and align with the customer on a daily basis, prepare internal summary reports and customer presentations
  • Escalate issues to the rest of the engineering team at other sites and work closely with them for resolutions
  • Collaborate closely with the engineering team to support, maintain, and enhance machine performance, implementing feedback from field experiences
  • Report identified issues and field observations to the engineering team, providing clear documentation to support continuous improvement efforts
  • Test, troubleshoot and recommend improvements to advanced packaging assembly equipment
  • Identifies, analyzes and resolves system design weaknesses

Qualifications

  • Bachelors Degree preferred in Mechanical or Electrical Engineering, Physics or other fields related to semiconductor packaging;
  • 2+ years of experience in a related field;
  • Knowledge of the semiconductor packaging is a plus;
  • Hands-on, strong aptitude and deep understanding of highly advanced machinery;
  • Experience with Advanced Packaging (flip chip, die attach or thermocompression bonding) or semiconductor manufacturing highly preferred;
  • Strong data analysis skills
  • Candidates with higher qualifications may be considered for a more senior position
  • Position to be located in Rio Rancho (New Mexico)

Kulicke & Soffa is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, sexual, gender identity or protected veteran status.
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: RTX11eb44
  • Position Id: ae6d7c4257fd61045c7a6b7e8e32df29
  • Posted 30+ days ago
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