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Software Engineering Director/Architect, 3DIC P&R & AI-driven EDA Automation

Austin, TX, US • Posted 8 days ago • Updated 10 hours ago

Full Time

On-site

Fitment

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Job Details

Skills

Software Engineering
Cadence
FOCUS
Java
Root Cause Analysis
Usability
Productivity
Debugging
Level Design
Collaboration
Data Structure
Algorithms
Tcl
Python
C++
Database
Routing
2.5D
Signal Integrity
EMIR
Workflow
Computer Science
Electrical Engineering
Computer Engineering
EDA
Data Analysis
Software Design
Artificial Intelligence
Packaging Design

Summary

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

We are looking for a Software Engineer to help build scalable EDA flows and AI-driven automation for advanced 3DIC applications. This role will focus on developing robust flow-generation capabilities, debugging assistance, root-cause analysis, and platform integration for 3DIC, interposer, and RDL system flows.
Core Responsibilities

Build scalable EDA flows using C++, Tcl, Python, and Java.
Develop AI/LLM-based automation for 3DIC applications, including flow generation, debugging assistants, and root-cause analysis capabilities.
Integrate 3DIC flows into a broader platform system supporting 3DIC, interposer, and RDL system flows.
Design and automate workflows that improve usability, productivity, and debug efficiency for complex package and system-level design challenges.
Collaborate with cross-functional engineering teams to define requirements, validate flow behavior, and deliver production-quality solutions.

Required Skills

Strong background in EDA data structures and algorithms.
Hands-on experience with Tcl, Python, and C++ automation in EDA tools.
Experience with DB-driven design flows, such as Innovus or similar implementation platforms.
Understanding of 3DIC, interposer, packaging routing, and RDL design flows.
Knowledge of constraint-driven design, including timing, signal integrity, DRC, and related implementation constraints.
Experience handling large-scale design problems, including high bump-count designs and multi-region routing challenges.

Preferred Skills

Experience with 3DIC, 3.5D, or 2.5D designs.
Familiarity with signal integrity, EMIR, and thermal considerations in advanced packaging environments.
Experience with LLM or AI systems, including agent frameworks and prompt-to-script automation.
Knowledge of multi-tool integration and end-to-end flow automation.
Ability to translate complex EDA workflows into scalable, user-friendly automation solutions.

Education and Experience

Bachelor's or Master's degree in Computer Science, Electrical Engineering, Computer Engineering, or a related technical field.
Relevant industry experience developing EDA software, design automation flows, AI/LLM-enabled engineering tools, or advanced packaging design solutions.

We're doing work that matters. Help us solve what others can't.

Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.

Dice Id: CADENCE
Position Id: 52163c877dffc84f4ef79a418c39934d
Posted 8 days ago

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