MEMS Wafer Integration Engineer

Corvallis, OR, US • Posted 4 days ago • Updated 27 minutes ago
Full Time
On-site
USD $116,150.00 - 182,400.00 per year
Fitment

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Job Details

Skills

  • Process Integration
  • Product Engineering
  • Process Flow
  • Demonstrations
  • Project Implementation
  • Collaboration
  • Manufacturing
  • IT Management
  • ROOT
  • Corrective And Preventive Action
  • Materials Science
  • Science
  • Semiconductors
  • MEMS
  • Microfabrication
  • Process Engineering
  • Semiconductor Fabrication
  • Photolithography
  • Thin Film
  • Metrology
  • Inspection
  • Design Of Experiments
  • Statistical Process Control
  • Data Analysis
  • Project Management
  • Communication
  • Presentations
  • Health Insurance
  • Insurance
  • Life Insurance
  • HP
  • Law

Summary

MEMS Wafer Integration Engineer

Description -

Job Summary

The MEMS organization is looking for an Expert level Silicon Wafer Fabrication Integration Engineer. This role is responsible for the end-to-end integration of silicon wafer fabrication processes supporting new technology development and manufacturing readiness. This role drives process integration strategies across photolithography, deposition, etch, metrology, and other semiconductor fabrication modules to deliver robust, manufacturable, high-performing, and reliable products.

The engineer works closely with process engineering, product engineering, design, quality, reliability, operations, and worldwide manufacturing partners to identify risks, solve complex technical issues, and accelerate technology development through qualification and production readiness.

Responsibilities
  • Define, develop, and optimize wafer process flows across multiple fabrication modules
  • Lead cross-functional teams to resolve integration, yield, reliability, and quality challenges
  • Drive characterization plans, design-of-experiments (DOE), process qualifications, and technology demonstrations
  • Evaluate interactions between process modules and identify integration risks, tradeoffs, and mitigation strategies
  • Support technology transfers to internal or external manufacturing sites
  • Lead technical reviews, integration meetings, and project execution plans
  • Collaborate with worldwide engineering teams to align process capabilities and manufacturing readiness
  • Provide technical leadership during fab escalations, root-cause investigations, and corrective action implementation

Education & Experience Recommended
  • Bachelor's or Advanced Degree in Material Science, Engineering, or Physical Sciences
  • 10 + years of experience in semiconductor, MEMS, or microfabrication process development and integration
  • Strong understanding of semiconductor fabrication processes including photolithography, thin film deposition, dry and wet etch, cleaning processes, and metrology and defect inspection

Knowledge & Skills
  • Demonstrated ability to solve complex technical problems using structured engineering methods
  • Experience with DOE, SPC, data analysis, and yield improvement methodologies
  • Project management skills
  • Strong written and verbal communication skills - ability to give clear and effective presentations to inform and persuade peers and managers
  • Proven ability to work effectively in cross-functional and global teams.

The pay range for this role is $116,150 to $182,400 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:
  • Health insurance
  • Dental insurance
  • Vision insurance
  • Long term/short term disability insurance
  • Employee assistance program
  • Flexible spending account
  • Life insurance
  • Generous time off policies, including;
  • 4-12 weeks fully paid parental leave based on tenure
  • 11 paid holidays
  • Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -
Engineering

Schedule -
Full time

Shift -
No shift premium (United States of America)

Travel -

Relocation -

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP's EEO Policy or read about your rights as an applicant under the law here: "Know Your Rights: Workplace Discrimination is Illegal"
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: 80183516
  • Position Id: cea88f5d227e126873395912f800dd07
  • Posted 4 days ago
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