You will join a digital hardware team and contribute across the full silicon development lifecycle - from preliminary analysis and micro-architecture definition through RTL development, functional verification, ASIC/FPGA/SoC implementation, on-hardware bring-up, and design documentation. Engineers are expected to be customer-facing: presenting technical solutions, gathering and documenting requirements, and supporting both PoC and production phases.
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Own block- and chip-level physical implementation: floorplanning, placement, clock tree synthesis, routing, and ECO closure through sign-off
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Close timing, power, and area (PPA) targets for high-performance compute subsystems: systolic arrays, compute tiles, memory macros, NoC, and I/O interfaces
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Design and optimize power delivery networks (PDN), power grids, and IR-drop analysis; implement power gating, voltage domains, and multi-corner power integrity sign-off
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Drive CTS and low-power implementation: skew/latency targets, clock gating integration, operand gating support, and DVFS-related timing corners
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Run STA, EM/IR, DRC/LVS, and physical verification; manage multi-mode multi-corner (MMMC) constraints and synthesis-to-PnR handoff quality
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Optimize floorplans for ML accelerator regularity: macro placement, datapath tiling, congestion management, and routability of high-utilization compute arrays
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Collaborate with RTL, verification, DFT, and architecture teams on constraint definition, timing exceptions, ECOs, and post-silicon debug support
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Support tape-out milestones on advanced nodes (7 nm, 5 nm, 3 nm or comparable): run management, QoR tracking, and foundry handoff
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Strong problem-solving under schedule pressure, scripting (Tcl/Perl/Python), and fluency with industry flows (InnovICC2, PrimeTime, StarRC, Calibre, RedHawk/Voltus)