Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we're more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
As a Principal Engineer (Hardware), Advanced Packaging, you will play a key role in advancing ASM's semiconductor process technologies. You'll leverage your expertise in thin-film deposition and materials characterization to develop innovative solutions for next-generation devices. Your work will directly influence product performance and enable breakthroughs in logic, memory, and power applications. We are currently recruiting for multiple openings.
What you will be working on- Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions and surface preparation.
- Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
- Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
- Provide expert technical support for complex electro/mechanical equipment and computer systems.
- Respond to and resolve issues escalated by first-line product support teams.
- Report design, reliability, and maintenance problems to engineering teams for resolution.
- Assist in customer installations and provide technical training as needed.
- Deliver support for highly technical or sophisticated products to customers and users.
- Travel globally up to 50% of the time to support field operations.
What we are looking for- Master's or PhD in Mechanical or Electrical Engineering preferred
- 10+ years of combined education, research, and work experience in thin-film deposition and advanced packaging processes.
- At least 5 years of experience in semiconductor process engineering or semiconductor equipment technology.
- 2-5 years of experience in customer support, product management, or product marketing roles.
- Demonstrated knowledge of hardware to process dependencies and comfort with fingerprinting chamber / tool critical components
- Proven experience in diagnosing and troubleshooting complex technical issues
- Strong understanding of electro/mechanical equipment and software systems
- Excellent problem-solving and analytical skills
- Ability to communicate effectively with both technical and non-technical stakeholders
- Strong presentation experience and skills
- Willingness and ability to travel globally up to 50% of the time; local and international
- Customer-focused mindset with the ability to manage challenging situations
Apply today to be part of what's next.We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what's possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.
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