Applications Engineer- SiC in Advanced Packaging

Applications Engineer- SiC in Advanced Packaging - Perm -Remote - $210,000 -$257,000

The final salary or hourly wage, as applicable, paid to each candidate/applicant for this position is ultimately dependent on a variety of factors, including, but not limited to, the candidate's/applicant's qualifications, skills, and level of experience as well as the geographical location of the position.

Applicants must be legally authorized to work in the United States. Visa sponsorship not available.

Our client is seeking a Applications Engineer- SiC in Advanced Packaging for a Remote Opportunity

Role Description

As an Applications Engineer for Advanced Packaging, you will provide pre- and post-sales technical support to customers integrating silicon carbide (SiC) substrates into 2.5D and 3D packaging architectures for high-performance computing (HPC) and AI data center applications.
You will serve as the technical bridge between advanced SiC materials and customer package design, helping customers understand where and how SiC delivers value across heat spreaders, carriers, passive and active interposers, and package substrates. In addition to supporting existing applications, you will identify and develop new opportunities for SiC adoption by collaborating with customers, foundries, OSATs, and ecosystem partners to co-design next-generation packaging solutions.
The ideal candidate will bring a strong technical background in semiconductor packaging, thermal management, thermal simulation, and process integration.
Guide customer packaging engineers, foundries, and OSATs in selecting the optimal SiC use case, including heat spreaders, carriers, passive and active interposers, and package substrates for advanced packaging architectures such as 2.5D and 3D heterogeneous integration.
Provide remote and on-site technical support throughout the design, validation, qualification, and commercialization process.
Identify and propose new SiC applications and partner with customers and ecosystem stakeholders to develop innovative packaging architectures.
Lead the design, development, and documentation of reference demonstrations showcasing SiC-based interposer, heat spreader, and substrate solutions.
Develop thermal performance benchmarks that quantify the advantages of SiC compared with silicon, glass, and ceramic materials.
Provide customers with validated material properties, including thermal conductivity data, anisotropic thermal characteristics, and bond-interface information to support package-level thermal modeling.
Develop and present technical content at industry conferences, trade shows, customer engagements, and technical workshops.
Support new product introductions and process design kit (PDK) launches, including training for internal sales teams, foundry partners, and EDA ecosystem providers on design guidelines, process windows, and integration best practices.
Capture and communicate customer requirements, market needs, and use-case priorities to product management teams to influence future product development and roadmap planning.

Skills & Requirements

Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical discipline.
Strong understanding of advanced semiconductor packaging ecosystems, including hyperscalers, foundries, OSATs, and supply chain partners.
Experience translating thermal, power density, reliability, warpage, and cost requirements into material and packaging solutions.
Knowledge of advanced packaging technologies including 2.5D and 3D integration, chiplet architectures, interposers, TSV fabrication, and heterogeneous integration.
Hands-on experience with thermal simulation tools such as ANSYS Icepak, FloTHERM, or similar platforms.
Ability to model, analyze, and communicate thermal performance in high-power-density semiconductor applications.
Familiarity with packaging process technologies including wafer thinning, RIE etching, metallization, micro-bump assembly, hybrid bonding, and coefficient of thermal expansion (CTE) considerations.
Experience with packaging-related EDA tools such as Cadence, Synopsys, or similar platforms is preferred.
Excellent verbal, written, presentation, and customer-facing communication skills.

Benefits/Other Compensation

Medical, Dental, Life Insurance, 401K.

Why Hays?

You will be working with a professional recruiter who has intimate knowledge of the industry and market trends. Your Hays recruiter will lead you through a thorough screening process in order to understand your skills, experience, needs, and drivers. You will also get support on resume writing, interview tips, and career planning, so when there's a position you really want, you're fully prepared to get it.

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Hays is committed to building a thriving culture of diversity that embraces people with different backgrounds, perspectives, and experiences. We believe that the more inclusive we are, the better we serve our candidates, clients, and employees. We are an equal employment opportunity employer, and we comply with all applicable laws prohibiting discrimination based on race, color, creed, sex (including pregnancy, sexual orientation, or gender identity), age, national origin or ancestry, physical or mental disability, veteran status, marital status, genetic information, HIV-positive status, as well as any other characteristic protected by federal, state, or local law. One of Hays' guiding principles is 'do the right thing'.
We also believe that actions speak louder than words.
In that regard, we train our staff on ensuring inclusivity throughout the entire recruitment process and counsel our clients on these principles. If you have any questions about Hays or any of our processes, please contact us.

In accordance with applicable federal, state, and local law protecting qualified individuals with known disabilities, Hays will attempt to reasonably accommodate those individuals unless doing so would create an undue hardship on the company. Any qualified applicant or consultant with a disability who requires an accommodation in order to perform the essential functions of the job should call or text .

Drug testing may be required; please contact a recruiter for more information.

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