Key Responsibilities
• System Architecture: Conceptualize and develop mechanical enclosures for electronic
products, ensuring designs meet all product specification requirements.
• Innovation & Design: Demonstrate a high degree of originality in defining product and project-
level architecture. Influence the design of interfaces between products to ensure seamless
interoperability.
• Problem Resolution: Resolve complex design issues at the system level. Act as a primary
point of contact for mechanical and thermal design responsibilities, interfacing with cross-
functional leaders to ensure rapid issue resolution.
• Manufacturing Collaboration: Drive the resolution of design issues by working closely with
CAD and manufacturing engineers throughout the development lifecycle.
• Technical Performance: Design and develop advanced thermal and structural solutions to
meet critical performance requirements.
Minimum Qualifications
• Education: BSME in Mechanical Engineering or equivalent.
• Experience: 8+ years of experience in electro mechanical enclosure design.
• Design Expertise: Broad knowledge of design constraints associated with sheet metal, plastic,
PCB layout, and die-cast design.
• Software Proficiency: Extensive experience with NX and TeamCenter and/or PTC’s Creo
design tools.
Preferred Skills
• Expertise in sheet metal enclosure design.
• Proficiency with structural analysis software tools.
• Proven track record of project leadership in a fast-paced, cross-functional environment.
• Strong analytical skills with a focus on system-level optimization and advanced thermal
management.
When submitting candidates, please include their updated résumé, current location, availability,
expected rate, and relevant experience with mechanical enclosures, sheet metal,
thermal/structural analysis, NX, TeamCenter, and Creo.
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