SOC Thermal Engineer

Austin, TX, US • Posted 7 days ago • Updated 4 hours ago
Full Time
On-site
Fitment

Dice Job Match Score™

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Job Details

Skills

  • Mobile Devices
  • Research and Development
  • High Performance Computing
  • Collaboration
  • Leadership
  • IC
  • Internal Communications
  • Integrated Circuit
  • Physical Data Model
  • System On A Chip
  • Thermal Analysis
  • Assembly
  • Electrical Engineering
  • Design Analysis
  • Testing
  • Semiconductors
  • Ansys
  • Fluency
  • Cadence
  • Allegro

Summary

Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device's thermal performance and participate in advanced IC packaging research and development.

Description

The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.

Minimum Qualifications

Bachelor's degree required.

Preferred Qualifications

Demonstrated leadership capabilities at the senior engineer level.

Deep expertise in thermal design for silicon devices and packaging solutions.

Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.

Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.

Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.

Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.

Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products

Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.

Experience designing and executing experimental test setups and analyzing thermal data.
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: 90733111
  • Position Id: de8697acf5f829835971395bb31326c4
  • Posted 7 days ago
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