ASIC Manufacturing Project Architect

We’re hiring for a full-time opportunity with a leading semiconductor R&D organization in USA. This role focuses on ASIC Manufacturing Project Architect. Detailed job description is given below. Please share your resume to 

Job Summary

We are seeking an experienced Project Architect to lead technical customer engagements for ASIC/SoC manufacturing projects. The ideal candidate will have deep expertise in ASIC Packaging, Production Test, Qualification, OSAT management, and semiconductor manufacturing, along with strong project management and customer-facing experience.

Key Responsibilities

• Lead technical customer engagements for ASIC/SoC manufacturing projects.
• Define project scope, timelines, costs, risks, and Statements of Work (SOW).
• Provide technical expertise in ASIC Packaging, Production Test, Qualification, and Supply Chain.
• Collaborate with customers, business development, and cross-functional engineering teams.
• Manage multiple projects and support pre-sales activities.

Required Skills

• MSc/PhD in Microelectronics, Electrical Engineering, Physics, or related field.
• 10+ years of experience in ASIC Post-Silicon Manufacturing.
• Strong expertise in:
  • Package Design (FCBGA, WLCSP, QFN, QFP)
  • Advanced Packaging (CoWoS, WoW, CoW)
  • Wafer Sort & Final Test
  • JEDEC Qualification (Automotive & Space)
  • Production Test & Qualification Flows
• Experience working with OSATs, NPI, SOW preparation, and project management.
• Excellent communication and customer-facing skills.