Do you love taking on big challenges that require exceptionally creative solutions? Do you deeply understand how an incredible camera experience should work? As part of our Camera Technologies group, you'll help design the innovative technology that allows each generation of Apple products to produce photos even more incredible than the last. You'll design and develop groundbreaking ideas for everything involved in our camera systems, from sensor to lens. You'll collaborate with teams across Apple to research, design, develop, test, and qualify camera hardware for Apple products. Together, we'll craft a magical photography experience that redefines what millions of customers can expect from their cameras.
Description
The Camera Hardware Engineering group is responsible for the design, development, and innovation of camera hardware for all related Apple products. Our target is to deliver extraordinary hardware to enable outstanding camera user experience. We are looking for an enthusiastic, passionate individual who can help us with tomorrow's challenges!
Minimum Qualifications
BS in Electrical Engineering, Computer Engineering, Physics, or related field with at least 3 years of relevant industry experience
Analog and/or digital circuit design including Schematics capture and/or supervising layout for substrate, rigid PCB, or Flex
Experience in signal and power integrity (High-speed design, PDN analysis)
Experience in system integration knowledge for grounding, shielding, EMI, EMC and ESD
Preferred Qualifications
Masters of Science or PhD in Electrical Engineering, Computer Engineering, Physics, or related field with 10 years of relevant industry experience.
Knowledge of layout strategies for Substrates, Rigid PCB, Flex, or Rigid-Flex including good understanding of material selection, Stack-up planning and noise suppression
Experience with high-speed interfaces : MIPI, DisplayPort, HDMI, PCIE etc., circuits and designs: LDO, Buck, ADC, DAC, Op-AMP, etc., and control interface like I2C, SPI, SPMI, UART, etc.
Hands-on lab experience with hardware bring-up and debug
Experience with high volume consumer electronics design for manufacturing, testing and reliability (DFM, DFT, DFR)
Knowledge of CMOS image sensor, ISP or image processing
Excellent written, verbal and communication skills focused on teamwork and collaboration in a dynamic cross-functional environment
Statistical data analysis and visualization (ex. JMP)
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
- Dice Id: 90733111
- Position Id: 257861f73421343eb8da003e8dadad4a
- Posted 4 days ago
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