Remote
•
18d ago
Contract role. 12 months Remote 3 Main priorities below: 1- Tile Based Approach 2-TessentSSN- specificallySSN 3- MCM Packages/Die-To-Die ChipsDFT engineer- Expert with Tessent tools. Experience with TessentSSN. Experience working on ATPG, MBIST, JTAG,DFTInsertion. Experience with ownDFTVerification. Experience with ICL PDL.
Easy Apply
Contract, Third Party
60 - 90


